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| Categories | Rectangular Connectors |
|---|---|
| Delivery Time: | 16-30 weeks |
| Mounting Type: | Surface Mount,Vertical |
| Row Spacing: | 1.27mm |
| Packaging Details: | SMD |
| Stock: | 28000 |
| Contact Material: | Copper alloy |
| Description: | Copper alloy 2 -55℃~+125℃ 1.27mm Surface Mount,Vertical SMD Headers, Male Pins RoHS |
| MOQ: | 280 |
| Brand Name: | 1714929 |
| Operating Temperature: | -55℃~+125℃ |
| Model Number: | 1714929 |
| Number of Rows: | 2 |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This SMD male connector, part of the FR 1,27/..-MV 3,25 product family, offers a compact and high-position solution for board-to-board or wire-to-board connections. Designed for space-saving device implementations, it facilitates stacked, coplanar, or orthogonal PCB connections for maximum design flexibility. The gold-plated contacts ensure stable long-term transfer quality. This connector can be combined with female connectors of different heights to achieve individual PCB spacings ranging from 8 mm to 13.8 mm.
| Specification | Value |
|---|---|
| Item Number | 1714929 |
| Number of Positions | 32 |
| Pitch | 1.27 mm |
| Number of Rows | 2 |
| Number of Potentials | 32 |
| Pin Layout | Linear pad geometry |
| Nominal Current (IN) | 1.4 A (at 20C 50-pos.) |
| Test Voltage | 500 V AC |
| Contact Resistance | 25 m |
| Insulation Resistance (neighboring positions) | 10 G |
| Rated Insulation Voltage (III/3) | 500 V |
| Rated Insulation Voltage (II/2) | 10 V |
| Rated Surge Voltage (II/2) | 0.8 kV |
| Mounting Type | SMD soldering |
| Process | Reflow soldering |
| Moisture Sensitive Level (MSL) | 1 |
| Classification Temperature (Tc) | 260 C |
| Contact Surface (top layer) | Gold (Au) |
| Contact Surface (middle layer) | Nickel (Ni) |
| Contact Surface (alloys) | Palladium nickel, (PdNi) |
| Soldering Area (top layer) | Tin (Sn) |
| Comparative Tracking Index (CTI) | 175 |
| Flammability rating (UL 94) | V0 |
| Width [w] | 25.41 mm |
| Height [h] | 8.95 mm |
| Length [l] | 7.2 mm |
| Installed height | 8.25 mm |
| Contact cover | 0.9 mm |
| Center offset (longitudinal and transverse) | 0.7 mm |
| Stack height | 12.3 mm (Tolerance: +1,5 mm with FP 1,27/...-FV 9,05) |
| Wipe length | 1.5 mm |
| Angular tolerance (longitudinal) | 4 |
| Angular tolerance (transverse) | 2 |
| PCB design Pad geometry | 0.8 x 1.1 mm |
| Insertion strength per pos. | approx. 0.5 N |
| Withdraw strength per pos. | approx. 0.5 N |
| No. of cycles (Durability) | 500 |
| Vibration test Frequency | 10 - 2000 - 10 Hz |
| Vibration test Amplitude | 1.5 mm (10 Hz ... 60.1 Hz), 20g (60.1 Hz ... 2000 Hz) |
| Shocks Acceleration | 50g |
| Shock duration | 11 ms |
| Ambient temperature (operation) | -55 C ... 125 C |
| Ambient temperature (storage/transport) | -40 C ... 70 C |
| Relative humidity (storage/transport) | 30 % ... 70 % |
| Ambient temperature (assembly) | -5 C ... 100 C |
| Type of packaging | 44 mm wide tape [W] |
| Tape width [W2] | 44 mm |
| Coil overall dimension [A] | 50.4 mm |
| Coil diameter | 330 mm |
| Outer packaging type | Transparent-Bag |
| ESD level (D) | electrostatically conductive |
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