| Connector Types | Printed Circuit Board (Vertical, Right-Angle), Cable
Assemblies/Wire Harnesses (Crimp and Poke, Solder Cup, Insulation
Displacement (IDC), Wire Wrap) |
| Position Sizes | 9, 15, 25, 37, 50 |
| Contact Types | Size 20 (Standard Density) |
| Current Rating | 5 Amps (Standard), 3 Amps (All-Plastic IDC) |
| Withstanding Voltage | Minimum 1000V RMS (Standard), Minimum 1250V RMS (High
Reliability/Military) |
| Contact Resistance | 2.7 milliohms maximum |
| Insulation Resistance | 5000 megohms minimum (initial); 1000 megohms (minimum) after
environmental testing |
| Durability | 500 mating cycles |
| Operating Temperature | -65C to +105C (Standard), -65C to +125C (High Reliability/Military) |
| Panel Mounting Specifications | Dimensions A, B, C, D, E, F, H (Refer to catalog pages 5-6 for
detailed measurements by shell size and position) |
| Shell Dimensions | Dimensions A, B, B1, C, D, D1, E, G, H, J, K, L, M (Refer to
catalog pages 6-7 for detailed measurements by shell size and
position) |
| PCB Layout Dimensions | Footprints and Hole Dimensions (Refer to catalog pages 7-9 for
details) |
| D*U Series (Crimp and Poke) Wire Gauge | 20-24 AWG |
| T* Series (All-Plastic IDC) Wire Gauge | 24-28 AWG |
| Basic D Series (Solder Cup) Wire Gauge | Accommodates up to 20 AWG wire |
| Basic D Series (Wire Wrap) Tail Lengths | .375" (9.53mm) or .585" (14.86mm) |
| Series 1 (High Reliability Solder Cup) Contact Plating | 30in gold over nickel |
| Series 3 (High Reliability Crimp and Poke) Contact Plating | 30in gold over nickel |
| M24308 Series (MIL-C-24308) Contact Plating | 50in gold over copper or nickel |
| M24308 Series (MIL-C-24308) Material | Insulator: Glass-filled diallyl phthalate (green) per MIL-M-14,
Type SDG-F; Shell: Steel with cadmium plating and yellow chromate
finish |
