| Sign In | Join Free | My infospaceinc.com |
|
| Sign In | Join Free | My infospaceinc.com |
|
| Categories | Memory Connectors |
|---|---|
| Delivery Time: | 1工作日 |
| Card Detection: | No |
| Model Number: | DM3D-SF |
| Operating Temperature: | -25℃~+85℃ |
| Brand Name: | DM3D-SF |
| Packaging Details: | SMD |
| Description: | Micro SD card (TF card) Connector and Ejector Push-Pull Surface Mount |
| Connector Type: | Connector and Ejector |
| Stock: | 3969 |
| MOQ: | 1 |
| Height Above Board: | 1.55mm |
| Card Connection Mode: | Push-Pull |
| Card Type: | MicroSD Card (TF Card) |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
The HIROSE DM3 Series microSD Card Connectors are designed for extremely small form factors and low above-the-board height, making them the smallest on the market. These connectors feature reverse card insertion protection, an effective ground and shield configuration for EMI protection, and a rigid, strong construction despite their compact size. Available in Push-Push (with ejection mechanism), Hinge Push-Pull (manual), and Push-Pull (manual) variants, they offer reliable card contact, easy inspection and rework of termination areas, and card fall-out prevention. Ideal for applications requiring compact and robust microSD card connectivity.
| Specification | Details |
|---|---|
| Common Features | Extremely small size, Reverse card insertion protection, Effective ground and shield configuration, Rigid and strong construction, Card detection switch (Normally Open) |
| Models | DM3AT, DM3BT (Push-Push, with ejection mechanism) DM3CS (Hinge, Push-Pull, manual, without ejection mechanism) DM3D (Push-Pull, manual, without ejection mechanism) |
| Ratings | Current: 0.5A Voltage: 125V AC |
| Operating Temperature Range | -25C to +85C (Includes temperature rise caused by current flow) |
| Storage Temperature Range | -40C to +85C (For products stored long periods prior to mounting and use) |
| Operating Humidity Range | 95% RH max. (No condensation) |
| Insulation Resistance | 100M min. (Initial value) |
| Withstanding Voltage | 500V AC / 1 minute, 1mA (No flashover or insulation breakdown) |
| Contact Resistance | 40m max. (change from initial value) |
| Vibration | Frequency: 10 to 55Hz, single amplitude of 0.75mm, 3 directions for 2 hours (No damage, cracks or parts dislocation) |
| Humidity (Damp Heat) | 96 hours at 40 2C, and humidity of 90 to 95% (No damage, cracks or parts dislocation) |
| Temperature Cycle | -55C 5 to 35C 85C 5 to 35C (Times: 30 min. 5 min. 30 min. 5 min., 5 cycles) (No damage, cracks or parts dislocation) |
| Durability | 10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B) 5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D) (No deformation of components affecting performance) |
| Resistance to Soldering Heat | Reflow: At recommended temperature profile Manual soldering: 350C for 3 seconds |
| Materials / Finish | Insulator: LCP (Color: Black) Contacts: Copper alloy (Contact area: Gold plated, Lead area: Gold plated) Guide cover: Stainless steel (DM3AT, DM3BT) Other components: Copper alloy, Stainless steel, Piano wire (DM3BT) |
| Product Number Structure | Series name, Connector type, Number of contacts, Termination type, Card ejection code |
| Packaging | Embossed carrier tape and reel |
Precautions: Do not immerse or clean with cleaning solutions. Avoid excessive force. Follow correct insertion/ejection procedures. Ensure correct mounting on PC board before card insertion. Mounting on FPC requires reinforcement plate (0.3mm min. thick). Small visible residual manufacturing fluids or tooling marks do not affect performance. Repeated card insertions/removals may mark the card but do not affect connector performance.
Recommended Temperature Profile for Reflow Soldering: Preheating: 90 to 120 seconds at 150C. Soldering Time: 50 seconds. Peak Temperature: 230C min. / 250C max.
|
