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| Categories | Backplane Connector |
|---|---|
| MOQ: | 480 |
| Stock: | 480000 |
| Model Number: | CP2-HA110-GA1-KR |
| Packaging Details: | - |
| Description: | Hard Metric, Standard RoHS |
| Brand Name: | CP2-HA110-GA1-KR |
| Delivery Time: | 15-21周 |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
The 3M CP2 Press-Fit Header offers a 2 mm grid spacing for high signal density at a low cost. Its "Eye of the Needle" compliant pin press-fit design reduces manufacturing time and cost. Features include three contact mating levels for Early Mate Late Break or "Hot Swap" applications, feed-through termination for midplane applications, and additional grounding rows for improved ground bounce and EMI immunity. It mates with 5-row 3M HSHM, UHM, and CP2 Sockets and is end-to-end stackable with 5-row 3M HSHM, HM, and CP2 Headers.
| Specification | Value |
|---|---|
| Insulation Material | Glass Filled Polyester (PBT) |
| Insulation Flammability | UL94V-0 |
| Contact Material | Copper Alloy |
| Mating Force | ≤ 0.75 N/PIN |
| Withdrawal Force | ≥ 0.15 N/PIN |
| Mating and Un-mating Operations | 200 (for KR plating) |
| Current Rating | 1.0 Amperes at 70°C (with all contacts powered) |
| Contact Resistance | ≤ 20 mΩ |
| Insulation Resistance | ≥ 10,000 MΩ |
| Test Voltage | 750 VACRMS |
| Temperature Ratings | -55°C to +125°C |
| Recommended PCB Plated Through Hole Diameter | Φ 0.6 ± 0.05 mm |
| Drill Hole Diameter | Φ 0.7 ± 0.02 mm |
| PCB Thickness (3.7 mm tails) | 2.4 - 5.6 mm |
| PCB Thickness (2.3 mm tails) | 1.4 - 5.6 mm |
| Press-In Force | ≤ 204 N/pin (on nominal hole diameter) |
| Retention Force | ≥ 13.5 N/pin (on nominal hole diameter) |
| Part Number Component | Description | Value |
|---|---|---|
| Loading Configurations | Grounding Options | G = with ground pins, Blank = without ground pins |
| EMLB Patterns | Primary Tail Length | 1 = 3.7 mm, 2 = 2.3 mm, 4 = 15.8 mm |
| Plating Options | FJ | 10~20 μ" Gold Contact Area, 100~200 μ" Matte Tin, 50~80 μ" Nickel Underplate (RIA E1 & C1 apply) |
| Plating Options | KR | 30~40 μ" Gold Contact Area, 100~200 μ" Matte Tin, 50~80 μ" Nickel Underplate (RIA E1 & C1 apply) |
| Plating Options | KV | 30-40 μ" Mate End Gold Contact area, Gold Flash Tail Contact area, 50-80 μ" Nickel Underplate (RIA E1 & C1 apply) |
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