TE Connectivity 3-1571552-0

DIP Socket with Four-Fingered Contact

DIP sockets provide a reliable method for assembling DIP packages onto a PCB, offering advantages such as component testing, upgradeability, exchangeability, and flexibility in IC design, assembly, and cost savings. They are an alternative to direct soldering, allowing for easier maintenance and design iterations.

DIP Socket with Dual Leaf Contact

DIP sockets with dual leaf contacts offer a robust solution for through-hole mounting on PCBs. Key features include specific pin counts, centerline spacing (CL), ladder (LDR) or over-the-component (OTC) frame styles, and tin plating.

Frequently Asked Questions

Question 1: When should I use a socket?

Answer 1: Benefits of using a socket include component test, upgrade and exchange, flexibility in IC design, assembly and cost savings.

Question 2: What's the difference between stamped contact and machined contact?

Answer 2: Stamping and machining are types of connector manufacturing technologies. TE has developed and produced DIP socket contacts using stamping technology as an alternative to traditional screw machined contacts, which is an economical option.

Question 3: What does 300 CL/600 CL, LDR, OTC mean in the description of DIP sockets with dual leaf contacts?

Answer 3: 300 CL means the centerline of the product is 0.3in (7.62mm). So, 600 CL means the centerline is 0.6in (15.24mm). LDR means that the frame is ladder style and OTC means the frame is over-the-component style.