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| Categories | Backplane Connector |
|---|---|
| Model Number: | CP2-HB110-GA1-KR |
| MOQ: | 576 |
| Packaging Details: | - |
| Brand Name: | CP2-HB110-GA1-KR |
| Stock: | 576000 |
| Delivery Time: | 15-21周 |
| Description: | Hard Metric, Standard RoHS |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
The 3M CP2 Press-Fit Header, part of the CP2 Series, offers a 2 mm grid spacing for high signal density at a low cost. It features an "Eye of the Needle" compliant pin press-fit design to reduce manufacturing time and cost. With three contact mating levels, it supports Early Mate Late Break or "Hot Swap" applications. Feed-through termination is available for mid-plane applications, and additional grounding rows can be added for improved ground bounce and EMI immunity. This header mates with 5-row 3M HSHM, UHM, and CP2 Sockets and is end-to-end stackable with 5-row 3M HSHM, HSM, HM, and CP2 Headers.
| Part Number Prefix | Signal Contacts | Grounding Option | Primary Tail Length | Plating Option | Connector Type | Dimension A (mm) | Dimension B (mm) | Dimension C (mm) |
|---|---|---|---|---|---|---|---|---|
| CP2-HB095 | 95 | G (with ground pins) | 3.7 mm (1) | E1-TG30 | B19 | 38.00 | 38.30 | 36.00 |
| CP2-HB095 | 95 | (Blank - without ground pins) | 3.7 mm (1) | A1-TG30 | B19 | 38.00 | 38.30 | 36.00 |
| CP2-HB095 | 95 | G (with ground pins) | 2.3 mm (2) | E1-TG30 | B19 | 38.00 | 38.30 | 36.00 |
| CP2-HB095 | 95 | G (with ground pins) | 15.8 mm (4) | GA4-KV | B19 | 38.00 | 38.30 | 36.00 |
| CP2-HB110 | 110 | G (with ground pins) | 3.7 mm (1) | E1-TG30 | B22 | 44.00 | 44.30 | 42.00 |
| CP2-HB110 | 110 | G (with ground pins) | 3.7 mm (1) | E1-TG30 | B22 | 44.00 | 44.30 | 42.00 |
| CP2-HB110 | 110 | G (with ground pins) | 3.7 mm (1) | GA1-TG30 | B22 | 44.00 | 44.30 | 42.00 |
| CP2-HB110 | 110 | G (with ground pins) | 15.8 mm (4) | GA4-KV | B22 | 44.00 | 44.30 | 42.00 |
| CP2-HB125 | 125 | (Blank - without ground pins) | 3.7 mm (1) | E1-TG30 | B25 | 50.00 | 50.30 | 48.00 |
| CP2-HB125 | 125 | G (with ground pins) | 3.7 mm (1) | E1-TG30 | B25 | 50.00 | 50.30 | 48.00 |
| CP2-HB125 | 125 | (Blank - without ground pins) | 3.7 mm (1) | A1-TG30 | B25 | 50.00 | 50.30 | 48.00 |
| CP2-HB125 | 125 | G (with ground pins) | 3.7 mm (1) | GA1-TG30 | B25 | 50.00 | 50.30 | 48.00 |
| Plating Option Code | Contact Area Plating | Tail Contact Area Plating | Underplate |
|---|---|---|---|
| FJ | 10~20 " Gold | 100~200 " Matte Tin | 50~80 " Nickel |
| KR | 30~40 " Gold | 100~200 " Matte Tin | 50~80 " Nickel |
| KV | 30-40 " Gold | Gold Flash | 50-80 " Nickel |
| Specification | Value |
|---|---|
| Mating Force | 0.75 N/PIN |
| Withdrawal Force | 0.15 N/PIN |
| Mating and Un-mating Operations | 200 (for KR plating) |
| Current Rating | 1.0 Amperes at 70C (all contacts powered) |
| Contact Resistance | 20 m |
| Insulation Resistance | 10,000 M |
| Test Voltage | 750 VACRMS |
| Recommended PCB Plated Through Hole Diameter | 0.6 0.05 mm |
| Drill Hole Diameter | 0.7 0.02 mm |
| PCB Thickness (3.7 mm tails) | 2.4 - 5.6 mm |
| PCB Thickness (2.3 mm tails) | 1.4 - 5.6 mm |
| Press-In Force | 204 N/pin (on nominal hole diameter) |
| Retention Force | 13.5 N/pin (on nominal hole diameter) |
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