Sign In | Join Free | My infospaceinc.com
infospaceinc.com
Products
Search by Category
Categories Memory Connectors
Operating Temperature: -40℃~+85℃
Card Detection: With Card Detect
Model Number: SMN-303
Card Type: Nano-SIM Card
Brand Name: SMN-303
Connector Type: Connector and Ejector
MOQ: 1
Height Above Board: 1.37mm
Packaging Details: SMD
Delivery Time: 1工作日
Stock: 21965
Description: Card Connector NANO SIM Push-Push Surface Mount
Card Connection Mode: Push-Push
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
Submit Buying Request
  • Product Details
  • Company Profile

XUNPU SMN-303

Product Overview

This product is a Nano SIM Card Push-Push connector designed for reliable card detection and connection. It features a high-temperature thermoplastic housing and copper alloy terminals, plated for optimal conductivity and durability. The design ensures secure card insertion and ejection with a push-push mechanism.

Key Features:

  • Card Detect Switch for confirmation of card presence.
  • Push-Push mechanism for easy card insertion and ejection.
  • High-temperature thermoplastic housing for durability.
  • Copper alloy terminals with Gold/Nickel plating for excellent conductivity.
  • Compliant with RoHS standards.

Application Scenarios:

Ideal for use in mobile devices, IoT devices, communication modules, and any application requiring a compact and reliable Nano SIM card interface.

Brand

DongGuan XunPu Electronics Co.,Ltd

Model

SMN-303

Product Type

Nano SIM Card Connector

Mechanism

Push-Push

Certifications

ROHS Compliant

Origin

China
Part NumberHousing MaterialTerminal MaterialShell MaterialTerminal PlatingShell PlatingRated Voltage (Max)Current Rating (Max)Insulation Resistance (Min)Contact Resistance (Max)Withstanding VoltageOperating TemperatureHumidity (Max)
SMN-303High Temperature ThermoplasticCopper AlloyStainless Steel50u" Ni UNDERPLATED OVERALL, G/F PLATED ON CONTACT AREA AND SOLDER AREA30u" Ni UNDERPLATED OVERALL, G/F PLATED ON CONTACT AREA AND SOLDER AREA30V AC0.5A1000M50m500V AC for 1 minute-25C to +85C80% R.H
ItemProduct NoQty/ReelReel/CartonKg/CartonQty/CartonCarton Size
SMN-303SMN-303150010350%350%34015000350mm x 350mm x 340mm
Packaging DetailMinimum LengthMinimum Width
Trailer Tape160mmN/A
Leader Tape100mmN/A
Empty Carrier TapeN/AN/A
Cover Tape200mmN/A
Cover Tape Peeling AnglePeeling Force
165 - 18020g - 130g
Buy XUNPU SMN-303 at wholesale prices
Send your message to this supplier
 
*From:
*To: Shenzhen ECER Network Technology Co., Ltd.
*Subject:
*Message:
Characters Remaining: (0/3000)
 
Inquiry Cart 0