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| Categories | Transistor Socket |
|---|---|
| Stock: | 1750 |
| Description: | Through Hole IC Sockets RoHS |
| MOQ: | 1 |
| Packaging Details: | Through Hole |
| Delivery Time: | 1 working day |
| Brand Name: | 8444-11B1-RK-TP |
| Model Number: | 8444-11B1-RK-TP |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Product Overview
The 3M Chip Carrier Sockets, 8400 Series, are designed for reliable
interfacing with chip carriers conforming to JEDEC outlines MO-047
for square and MO-052 for rectangular devices. These low-profile,
four-row, through-hole sockets are compatible with automated
loading equipment, featuring an open top design for unrestricted
airflow and molded slots for easy device extraction. They are
suitable for wave soldering processes. These sockets are RoHS
Compliant, with specific compliance information available in the
Regulatory Information Appendix (RIA) in the "RoHS Compliance"
section of www.3Mconnector.com (RIA E1 and C1 apply).
Important Notice Regarding Tin Whisker Growth:
3M PLCC products are tin-plated on the contact wiping surface, a
necessary feature for ensuring mated reliability as standard PLCC
contacts are also tin-plated. Tin whiskers are an inherent
characteristic of tin, and mechanical stressing can promote their
growth. It is possible for the PLCC and PLCC socket to exhibit tin
whisker growth after mating. 3M adheres to iNEMI plating
recommendations, utilizing whisker-mitigating tin plating chemistry
to reduce the likelihood of growth. Users should carefully consider
the suitability of a PLCC socket for their specific application,
taking into account the product application's lifespan and
environment, including mechanical stresses, humidity, and thermal
cycling, which are known to stimulate tin whisker growth.
| Specification | Details |
|---|---|
| Chip Carrier Compatibility | JEDEC outline MO-047 (square) and MO-052 (rectangular) |
| Automation Compatibility | Compatible with automated loading equipment |
| Design Feature | Open top for unrestricted air flow; Molded slots for device extraction |
| Soldering Compatibility | Wave Solder Compatible (Not suitable for reflow soldering) |
| Contact Plating (Underplating) | 50 " [1.27 m] Nickel |
| Contact Plating (Wiping Area) | 160 " [4.06 m] Matte Tin |
| Contact Resistance | 15 m |
| Insulation Resistance | >103 M minimum |
| Capacitance | <1 pF at 1 MHz |
| Temperature Rating | -40C to +105C |
| Process Rating | Wave Solder Only |
| Contact Quantity | Part Number | A (mm [inch]) | B (mm [inch]) | C (mm [inch]) | D (mm [inch]) |
|---|---|---|---|---|---|
| 20 | 8420-11B1-RK-TP | 15.50 [0.611] | 15.50 [0.611] | 5.08 [0.200] | 5.08 [0.200] |
| 28 | 8428-11B1-RK-TP | 18.05 [0.711] | 18.05 [0.711] | 7.62 [0.300] | 7.62 [0.300] |
| 32 | 8432-11B1-RK-TP | 18.05 [0.711] | 20.60 [0.812] | 7.62 [0.300] | 10.16 [0.400] |
| 44 | 8444-11B1-RK-TP | 23.50 [0.926] | 23.50 [0.926] | 12.70 [0.500] | 12.70 [0.500] |
| 52 | 8452-11B1-RK-TP | 25.88 [1.020] | 25.88 [1.020] | 15.24 [0.600] | 15.24 [0.600] |
| 68 | 8468-11B1-RK-TP | 31.05 [1.223] | 31.05 [1.223] | 20.32 [0.801] | 20.32 [0.801] |
| 84 | 8484-11B1-RK-TP | 36.05 [1.420] | 36.05 [1.420] | 25.40 [1.001] | 25.40 [1.001] |
Note: Dimensions are for reference only. Tolerance Unless Noted: .3 mm for .0, .20 mm for .00.
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