HRS DF59-4P-2C

Low Profile Interconnect System

Developed for LED applications, this system offers an ultra-low profile design that minimizes shadowing. It features a unique "Swing-lock" engagement for strong plug retention against cable pull and high current capability of 3 Amps. The floating Board-to-Board connector with "Stress free contact" allows for 0.5 mm floating in XYZ directions, enabling multiple Board-to-Board connections to minimize thermal expansion issues. It is RoHS compliant and cUL Pending.

Key Features:

• Ultra low profile design minimizes shadowing.
• Wire-to-Board, Board-to-Board, and Short-Circuit applications are compatible with a common header.
• Positive "Swing-lock" engagement provides strong plug retention.
• High current capability: 3 Amps.
• Floating Board-to-Board connector with "Stress free contact" allows 0.5 mm floating in XYZ directions.
• Multiple Board-to-Board connections minimize thermal expansion issues.
• Temperature range: -35C to 105C.
• For AWG #22: 1.2 to 1.45 mm diameter.