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| Categories | Memory Connectors |
|---|---|
| Description: | -25℃~+85℃ Push-Push 1.9mm SMD PC Card Sockets RoHS |
| Card Connection Mode: | Push-Push |
| Stock: | 50000 |
| Brand Name: | SHETIME |
| Operating Temperature: | -25℃~+85℃ |
| Model Number: | SMP11-S1S1-2000-A |
| MOQ: | 500 |
| Packaging Details: | SMD |
| Delivery Time: | 3-5 working days |
| Height Above Board: | 1.9mm |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Function: SIM Memory Card Connector designed for performance, tests, and quality requirements. Provides space savings and improved functionality for system signal transfer.
Usage: Primarily used in systems requiring SIM card connectivity, offering efficient signal transfer.
Advantages: Space-saving design, improved functionality.
Application Scenarios: Systems requiring SIM card interfaces.
| Specification | Description | Value | Test Method |
|---|---|---|---|
| Materials - Contact | High performance copper alloy (Phosphor Bronze) | - | - |
| Materials - Contact Finish | (a) Contact Area: Gold over Nickel (b) Solder Tail area: Gold over Nickel | - | - |
| Materials - Housing | LCP+30%G.F, UL94V-0 | - | - |
| Ratings - Voltage | 500 Volts DC, 250 Volts AC(rms) (per pin) | - | - |
| Ratings - Current | 0.5 Amperes DC (per pin) | - | - |
| Ratings - Operating Temperature | -25 TO +85 | - | - |
| ELECTRICAL - Low-Signal Level Contact Resistance | R<100 m | <100 m | MIL-STD-202F, Method 302 |
| ELECTRICAL - Insulation Resistance | R>1000 M | >1000 M | MIL-STD-202F, Method 302 |
| ELECTRICAL - Dielectric Withstanding Voltage | No discharge, flashover or breakdown. | 500 V initial and 250 V final for 1 minute | MIL-STD-202F, Method 301 |
| MECHANICAL - Retention Force | 100 Gram(0.98N) minimum (per pin) | 100 g (0.98 N) | MIL-STD-1344A, Method 2012.1 |
| MECHANICAL - Vibration | Discontinuity 1.0 microsec. MAX | 1.0 s MAX | MIL-STD-202 Method 201 (Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz for 2 hours in each of 3 axes) |
| MECHANICAL - Durability | 5000 cycles | 5000 cycles | MIL-STD-1344A, Method 2016 |
| Solderability | Solderable area shall have minimum of 95% solder coverage. | 95% | Bath at 2705 for 30.5 seconds |
| ENVIRONMENTAL - Salt Spray | Oxidation of not more than 5% | 5% oxidation | 352 for 24 hours (MIL-STD-1344A, Method 1001.1) |
| ENVIRONMENTAL - Temperature Life (Heat Aging) | A. Products in 852 96 hours, the product can still be used
normally. B. Products in 2605 or eight of the reflow temperature (maximum temperature of 260), the deformation of not more than 0.08 mm. | A. Normal use at 852 for 96h. B. Deformation 0.08 mm at 2605 (max reflow temp) | MIL-STD-202F, Method 108A |
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