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| Categories | Memory Connectors |
|---|---|
| Packaging Details: | SMD |
| Model Number: | TFC6A-N1S1-2000-A |
| MOQ: | 1000 |
| Delivery Time: | 3-5工作日 |
| Card Type: | MicroSD Card |
| Card Connection Mode: | Push-Push |
| Height Above Board: | 1.8mm |
| Description: | Push-Push 1.8mm MicroSD Card SMD PC Card Sockets RoHS |
| Brand Name: | TFC6A-N1S1-2000-A |
| Stock: | 100000 |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH, which is designed and manufactured by Company. This product is a TF card connector designed for surface mounting.
| Item | Requirements | Test Methods |
|---|---|---|
| Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| Contact resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| Durability (Repeated Mating/Unmating) | Contact Resistance: 100 m Max. after testing | Mate and unmate connector for 5000 cycles. |
| Temperature rise | 30C Max. | Not Specified |
| Section | Description |
|---|---|
| SOLDERABILITY | Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants. |
| RESISTANCE TO SOLDER HEAT - Wave Soldering | Consists of three consecutive phases: Preheat (Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature.), Soldering (Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds.), Cool Down (Cool down in ambient air at approximately 20 to 25). |
| RESISTANCE TO SOLDER HEAT - INFRARED REFLOW | Three cycles. Each cycle consisting of three consecutive phased: Preheat (Increase in temperature not to exceed 4 per second.), Soldering (Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds.), Cool Down (Cool down shall not exceed 6 per second.). Device temperature measurements are referenced from the top-center of the package outer surface. |
| CLEANING | Connectors resist to cleaning process. Aqueous Cleaning: Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121. |
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