| Sign In | Join Free | My infospaceinc.com |
|
| Sign In | Join Free | My infospaceinc.com |
|
| Categories | Memory Connectors |
|---|---|
| Brand Name: | TFW15-N1S1-2000-A |
| Connector Type: | Connector and Ejector |
| Model Number: | TFW15-N1S1-2000-A |
| Stock: | 100000 |
| Card Connection Mode: | Push-Push |
| Description: | Push-Push 2mm Connector and Ejector MicroSD Card (TF Card) SMD PC Card Sockets RoHS |
| Card Type: | MicroSD Card (TF Card) |
| MOQ: | 1000 |
| Height Above Board: | 2mm |
| Delivery Time: | 3-5工作日 |
| Packaging Details: | SMD |
| Card Detection: | Yes |
| Supplementary Features: | With Locating Pins |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This product specification defines the product performance and the test methods to ascertain the performance of the T-FLASH connector, which is designed and manufactured by Dongguan Gaoyueda Electronics Co., Ltd. It is a T-Flash external welding type connector.
Dongguan Gaoyueda Electronics Co., Ltd.
TFW15-N1S1-2000-A
T-Flash type CONN.
China
RoHS
Tape & Reel
| Item | Requirements | Test Methods |
|---|---|---|
| 1. Confirmation of Product | Product shall be conforming to the requirements of applicable product drawing. | Visually, dimensions and functionally inspected per applicable product drawing. |
| 2. Contact resistance (Low Level) | 80 m Max. initial | Subject mated contacts assembled in housing to closed circuit of 10 mA max. at open circuit voltage of 20 mV max. |
| 3. Insulation resistance | 1000 M Min. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 302, Condition B (500 V DC10%). |
| 4. Dielectric Strength | Connector must withstand test potential of 500 V AC for 1 minute. Current leakage must be 1.0 mA max.. | Measure by applying test potential between the adjacent contacts, and between the contacts and ground in the mated connector. MIL-STD-202, Method 301. |
| 5. Durability (Repeated Mating/Unmating) | 10 cycles | Samples are pre-conditioned with 10 cycles of durability. |
| Environmental Requirement | Specification | Test Method |
|---|---|---|
| Solderability | Connectors solderability can meet MIL-STD-202F standard. Finish shall be free of contaminants. | MIL-STD-202F |
| Resistance to Solder Heat (Wave Soldering) | Preheat: Increase in temperature not to exceed 4 per second. Final preheat temperature will be within 125 of solder temperature. Soldering: Device leads will be exposed to solder wave at 250 for a maximum of 5 seconds. Cool Down: Cool down in ambient air at approximately 20 to 25. | - |
| Resistance to Solder Heat (Infrared Reflow) | Preheat: Increase in temperature not to exceed 4 per second. Soldering: Maximum allowable time above reflow temperature of 183 is 90 seconds. Maximum temperature in this interval is 260, not to exceed 10 seconds. Cool Down: Cool down shall not exceed 6 per second. | - |
| Cleaning (Aqueous Cleaning) | Three cycles; each cycle consisting of a maximum of one minute exposure to 54 to 66 demineralized tap water at a maximum pressure of 30 psi; followed by air drying for 60 to 90 seconds at 93 to 121. | - |
|
