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| Categories | D Sub Connectors |
|---|---|
| Packaging Details: | - |
| Model Number: | MDSSTS |
| Delivery Time: | 10-15 working days |
| MOQ: | 1000 |
| Brand Name: | ITT CANNON |
| Description: | D-Sub, D-Shaped Connector Contacts RoHS |
| Stock: | 13192 |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
The MICRO MDSM is a shielded interface connector from Cannon's Microminiature series, designed for applications requiring specific shielding capabilities, particularly in telecommunications and computer components. It is compatible with modern soldering methods like IR reflow and vapor phase soldering. Available as a cable connecting receptacle with crimp contacts (sockets only) or as a PCB connector with 90 solder pins. Contacts are spaced at 1.27 mm, with solder pins at 1.27 x 2.54 mm. Various locking devices are available.
| Part Number | Series | Number of Contacts | Contact Type | Termination Method | Mounting Method | Packaging | Dimensions (A max x B x C) |
| MDSM-9SC-Z11-VS1 | MICRO MDSM | 9 | Socket | Crimp | Screw, long, blank | VS1 | 19.9 x 14.35 x 9.45 mm |
| MDSM-9SC-Z24-VS1 | MICRO MDSM | 9 | Socket | Crimp | Push pull | VS1 | 19.9 x 14.35 x 9.45 mm |
| MDSM-15SC-Z11-VS1 | MICRO MDSM | 15 | Socket | Crimp | Screw, long, blank | VS1 | 23.7 x 18.16 x 13.25 mm |
| MDSM-15SC-Z24-VS1 | MICRO MDSM | 15 | Socket | Crimp | Push pull | VS1 | 23.7 x 18.16 x 13.25 mm |
| MDSM-25SC-Z11-VS1 | MICRO MDSM | 25 | Socket | Crimp | Screw, long, blank | VS1 | 30.05 x 24.5 x 19.6 mm |
| MDSM-25SC-Z24-VS1 | MICRO MDSM | 25 | Socket | Crimp | Push pull | VS1 | 30.05 x 24.5 x 19.6 mm |
| MDSM-9PE-Z*-VR25 | MICRO MDSM | 9 | Pin | Solder pin 90 | Z7, Z10, Z12 | VR | 19.9 x 14.35 x 8.6 mm |
| MDSM-15PE-Z*-VR22 | MICRO MDSM | 15 | Pin | Solder pin 90 | Z7, Z10, Z12 | VR | 23.7 x 18.16 x 12.4 mm |
| MDSM-25PE-Z*-VR17 | MICRO MDSM | 25 | Pin | Solder pin 90 | Z7, Z10, Z12 | VR | 30.05 x 24.5 x 18.8 mm |
| MDSM-18PE-Z*-VR25 | MICRO MDSM Doubledecker | 18 | Pin | Solder pin 90 | Z7, Z10, Z12 | VR | 19.9 x 14.35 x 8.6 mm |
| MDSM-30PE-Z*-VR22 | MICRO MDSM Doubledecker | 30 | Pin | Solder pin 90 | Z7, Z10, Z12 | VR | 23.7 x 18.16 x 12.4 mm |
| MDSM-9PA-Z7/Z10 | MICRO MDSM | 9 | Pin | Straight solder pins | Z7, Z10 | N/A | N/A |
| MDSM-9PA-Z41/Z42 | MICRO MDSM | 9 | Pin | Straight solder pins | Z41, Z42 | N/A | N/A |
| MDSM-9PC-Z7/Z10-O-VS1 | MICRO MDSM | 9 | Pin | Crimp termination | Z7, Z10 | VS1 | N/A |
| MDSM-9PC-Z42-O-VS1 | MICRO MDSM | 9 | Pin | Crimp termination | Z42 | VS1 | N/A |
| Specification | Value |
| Insulator | Thermoplast, UL94V-0 |
| Contact guiding plate | PA, high temperature resistant |
| Shell | Steel, tinned and nickel plated |
| Contacts | Copper alloy |
| Contact finish | Gold over PdNi |
| Contact termination area | Tin (SnPb) / tinned |
| Contact spacing | 1.27 mm |
| Temperature range | 55 / 125C |
| Electrical Data (Standard) | Current rating: 2.5 A / 25C Test voltage: 350 Vrms Contact resistance: 20 m max (crimp), 35 m max (pcb) Insulation resistance: 5000 M min |
| Electrical Data (Doubledecker) | Current rating: 2.5 A / 25C (row 1, 2), 1.8 A / 25C (row 3, 4) Test voltage: 350 Vrms Contact resistance: 35 m max (row 1, 2), 55 m max (row 3, 4) Insulation resistance: 5000 M min |
| Shielding Effectiveness | 10 MHz: 56 dB 30 MHz: 47 dB 159 MHz: 34 dB 500 MHz: 26 dB 750 MHz: 22 dB 1000 MHz: 19 dB |
| Wire size (Crimp) | AWG 28 26 |
| Insulation dia. (Crimp) | 0.95 mm max |
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