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SHETIME SMP21-S1S1-2000-A

Categories Memory Connectors
Brand Name: SMP21-S1S1-2000-A
MOQ: 500
Card Connection Mode: Push-Push
Operating Temperature: -25℃~+85℃
Packaging Details: SMD
Model Number: SMP21-S1S1-2000-A
Stock: 50000
Delivery Time: 3-5工作日
Height Above Board: 1.9mm
Description: -25℃~+85℃ Push-Push 1.9mm SMD PC Card Sockets RoHS
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SHETIME SMP21-S1S1-2000-A

Product Overview

This specification covers performance, tests, and quality requirements for SIM Memory Card Connectors. These connectors provide space savings and improved functionality for system signal transfer.

Brand GYUEDA
Part Number SMP21-S1S1-2000-A
Origin DONGGUAN GYUEDA ELECTRONICS CO.,LTD
Taiwan Factory
China Factory
SpecificationDescriptionRequirementTest ConditionStandard
Materials - ContactHigh performance copper alloy (Phosphor Bronze)
Finish - Contact AreaGold over Nickel
Finish - Solder Tail AreaGold over Nickel
Materials - HousingLCP+30%G.F, UL94V-0
Voltage Rating500 Volts DC, 250 Volts AC(rms) (per pin)
Current Rating0.5 Amperes DC (per pin)
Operating Temperature-25 TO +85
Low-Signal Level Contact ResistanceR<100 m<100 mApply DC 50010% Volts between adjacent contacts of mated connectors for one minute.MIL-STD-202F, Method 302
Insulation ResistanceR>1000 M>1000 MApply DC 50010% Volts between adjacent contacts of mated connectors for one minute.MIL-STD-202F, Method 302
Dielectric Withstanding VoltageNo discharge, flashover or breakdown.500 V initial and 250 V final for 1 minute.MIL-STD-202F, Method 301
Retention Force100 Gram (0.98N) minimum (per pin)100 Gram (0.98N) minimumMate connector with a suitable gauge for each pin at rate of 25 mm/min.MIL-STD-1344A, Method 2012.1
VibrationDiscontinuity 1.0 microsec. MAX1.0 microsec. MAXMate dummy card and subject to Vibration conditions for 2 hours in each of 3 axes. Amplitude: 1.52 mm P-P, Frequency: 10-55-10 Hz (traversed in 1 minute).MIL-STD-202 Method 201
Durability5000 cycles5000 cyclesThe sample should be mounted in the tester at a rate of 25mm/min.MIL-STD-1344A, Method 2016
SolderabilitySolderable area shall have minimum of 95% solder coverage.Minimum of 95% solder coverageSubject test area to flux for 30.5 seconds and then into solder bath at 2705 for 30.5 seconds.
Salt SprayOxidation of not more than 5%Not more than 5% oxidationSubject mated/unmated connectors to 51% salt-solution concentration, 352 for 24 hours.MTL-STD-1344A, Method 1001.1
Temperature Life (Heat Aging)A. Products in 85 2 for 96 hours, can still be used normally. B. Products in 260 5 or over eight reflow temperature cycles (max 260 ), deformation not more than 0.12 mm.A. Normal use after 96 hours at 852. B. Deformation < 0.12 mm after reflow.MTL-STD-202F, Method 108A
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