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XUNPU TYC-325-CB08

Categories USB DVI HDMI Connectors
Current Rating: 5A
MOQ: 1000
Delivery Time: 12-17 working days
Number of Contacts: 24P
Stock: 5000
Mounting Type: Laminated board
length: 7.9mm
Operating Temperature: -30℃~+80℃
Description: USB-C (USB TYPE-C) Receptacle Connector 24 Position Recessed Mount
Connector Type: Type-C
Gender: Female
Brand Name: XUNPU
Number of Ports: 1
Detection color: Black
Model Number: TYC-325-CB08
Packaging Details: SMD
Connect-Disconnect Life: 10,000 cycles
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XUNPU TYC-325-CB08

Product Overview

This specification covers the performance, tests, and quality requirements for the XUNPU ELECTRONICS CO.,LTD USB 3.1 TYPE-C series connectors. Designed for general applications, these connectors provide reliable electrical and mechanical performance.

Product Attributes

  • Brand: XUNPU ELECTRONICS CO.,LTD
  • Origin: DONGGUAN XUNPU ELECTRONICS CO.,LTD
  • Product Type: USB 3.1 TYPE-C Connector
  • Model Series: USB 3.1 TYPE C

Technical Specifications

SpecificationDetails
Product ModelTYC-325-CB08
Voltage Rating30V AC
Current Rating3A
Operation Temperature Range-30 to +80
Test Temperature Range-15 to +35
Test Humidity Range25% to 85%
Contact Resistance (Dry Circuit)40m MAX
Dielectric Withstanding Voltage100V AC (RMS) for 1 minute between adjacent terminals of ground (No Breakdown or flashover, Leakage current: 0.5mA Max)
Insulation Resistance (Unmated)100M min (Applied 500V DC for 1 minute between adjacent terminals of ground)
Insertion Force0.50kgf/MIN, 2.0kgf/MAX
Withdrawal Force0.80kgf/MIN, 2.0kgf/MAX
Durability Cycles10,000 cycles
Vibration (Amplitude)1.52mm P-P or 147m/s {15G}
Vibration (Sweep Time)50-2000-50Hz in 20 minutes
Vibration Contact Resistance Change30m Max (DC 100mA current flowed during test)
Physical Shock (Acceleration)490m/s (50G)
Physical Shock Pulse Width11msec (Half-sine waveform)
Physical Shock Contact Resistance Change40m Max (During test)
Thermal Shock Cycles10 cycles of (-553 for 30 min) and (+853 for 30 min)
Thermal Shock Contact Resistance Change40m Max (After test)
Solder AbilityDipped in solder bath 2605 for seconds; 95% solder coverage required on inspected area of each lead.
Humidity (Mated) Contact Resistance Change30m Max (After 96 hours at +25 to +85, 90% to 95% RH)
Humidity (Unmated) Dielectric Withstanding VoltageConform to requirements (After 96 hours at +25 to +85, 90% to 95% RH)
Humidity (Unmated) Insulation ResistanceConform to requirements (After 96 hours at +25 to +85, 90% to 95% RH)
Salt Spray Duration (Condition 1)24 hours (Contact plated gold 15u, shell: copper alloy or stainless steel)
Salt Spray Duration (Condition 2)12 hours (Contact plated gold < 15u, and/or shell: steel)
Salt Spray ResultNo detrimental corrosion (Terminal solder tail unrequested)
Cold Resistance Contact Resistance Change30m Max (After 168 hours at -253)
Cold Resistance Shell Part Change50m Max (After 168 hours at -253)
Heat Resistance Contact Resistance Change30m Max (After 168 hours at 852, Mated connectors)
Heat Resistance Shell Part Change50m Max (After 168 hours at 852, Mated connectors)
Thermal Aging Contact Resistance Change40m Max (After 250 hours at +852, Unmated connectors)
IR-reflow Solder Temp2605, 101sec
IR-reflow ResultNo physical damage shall occur.
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