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| Categories | Rectangular Connectors |
|---|---|
| Stock: | 3000 |
| Packaging Details: | SMD,P=2mm |
| Number of Rows: | 1 |
| Pitch: | 2mm |
| Pins Structure: | 1x8P |
| MOQ: | 600 |
| Description: | 1x8P Tin 2mm 100V 8 1 Surface Mount,Vertical -25℃~+85℃ SMD,P=2mm Headers, Male Pins RoHS |
| Contact Plating: | Tin |
| Mounting Type: | Surface Mount,Vertical |
| Delivery Time: | 7-15工作日 |
| Number of PINs Per Row: | 8 |
| Model Number: | HY-8ALT |
| Z-Height of the Board: | 8.1mm |
| Contact Material: | Phosphor Bronze;PA66 |
| Y-Width of Bottom Edge on Board: | 5.1mm |
| Voltage Rating (Max): | 100V |
| Brand Name: | HY-8ALT |
| Operating Temperature: | -25℃~+85℃ |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Scope: This specification applies to the ZH series connector strip, covering product performance, test methods, and inspection requirements.
Applicable Standards: GB/T2421, GB/T2423, GB/T2424, GB/T5095.
Use Conditions:
Appearance and Dimension: Product surface should be free from defects, dirt, cracks, and mechanical damage. Contacts should be free from rust, and plating should not be oxidized or peeled. Dimensions are according to drawings. Products of the same specification should be interchangeable.
| Part No. | Item | Material | Finish | Type | Requirement |
|---|---|---|---|---|---|
| N/A | Terminal | Phosphor bronze | Tin Plating: 3~5m | Contact | Thickness: 0.20mm |
| N/A | Housing | Nylon66 | Color: White | Plastic Shell | UL94V-0 |
| N/A | Housing | PBT | Color: White | Plastic Shell | UL94V-0 |
| N/A | Wafer | Brass | Tin Plating: 2.5~5m | Contact Pin | Thickness: 0.50mm |
| N/A | Wafer | PBT | Color: White | Plastic Shell | UL94V-0 |
| N/A | Wafer | Brass | Tin Plating: 2.5~5m | Contact Pin | Thickness: 0.50mm |
| N/A | Wafer | PBT | Color: White | Plastic Shell | UL94V-0 |
| N/A | Wafer | Brass | Tin Plating: 2.5~5m | Contact Pin | Thickness: 0.50mm |
| N/A | Wafer | PA46 | Color: Beige | Plastic Shell | UL94V-0 |
| N/A | Wafer | Brass | Tin Plating: 2.5~5m | Contact Pin | Thickness: 0.50mm |
| N/A | Wafer | PA6T | Color: Beige | Plastic Shell | UL94V-0 |
| N/A | Wafer | Phosphor bronze | Tin Plating: 3~5m | Solder tab | Thickness: 0.25mm |
| N/A | Wafer | PA6T | Color: Beige | Plastic Shell | UL94V-0 |
| N/A | Wafer | Brass | Tin Plating: 2.5~5m | Contact Pin | Thickness: 0.50mm |
| N/A | Wafer | Phosphor bronze | Tin Plating: 3~5m | Solder tab | Thickness: 0.25mm |
| No. | Item | Test Mode | Requirement |
|---|---|---|---|
| 6.1 | Current Rated | N/A | 1A AC DC |
| 6.2 | Voltage Rated | N/A | 100V AC DC |
| 6.3 | Contact Resistance | Mate connector, 20mV max voltage, 100mA max current | Initial value 20m |
| 6.4 | Withstand Voltage | Apply 500V AC (rms) for 1 minute between adjacent terminals and ground | No breakdown or flashover, leakage current 0.5mA |
| 6.5 | Insulation Resistance | Apply 500V DC (rms) for 1 minute between adjacent contacts | 500 M |
| 7.1 | Terminal crimping wire strength | AWG#26 wire: > 20N; AWG#28 wire: > 13N; AWG#30 wire: > 8N; AWG#32 wire: > 6N (pullout force at 253mm/min) | N/A |
| 7.2 | Fixed terminals and hole seat | Pull-out force at 253mm/min along wire direction | Per contact: 10N |
| 7.3 | Single contact insertion force | Mate connectors at 253mm/min | 6N |
| 7.4 | Single contact withdrawal force | Mate connectors at 253mm/min | 0.6N |
| 7.5 | Pin Retention force | Force on pin end at 253mm/min until needle exits seat | Per contact: 10N |
| 7.6 | Durability | 30 cycles (max 10 cycles/min) prior to environmental test | Contact Resistance 30 m |
| 7.7 | Vibration | 10-55-10 Hz/min, 1.5mm p-p amplitude, 2 hours per axis (X, Y, Z) | Appearance: No damage; Contact Resistance 30 m; Current Discontinuity: 1sec Max |
| 8.1 | Thermal Aging | 852 for 96 hours | Appearance: No damage; Contact Resistance 30 m |
| 8.2 | Temperature Rise | Measure temperature rise at max rated current | 30 Max |
| 8.3 | Humidity | 402, 90-95%RH for 96 hours | Appearance: No damage; Contact Resistance: 30m; Insulation Resistance: 250M; No breakdown or flashover |
| 8.4 | Temperature Cycling | 5 cycles: -553 (30min) -> Room temp (10-15min) -> 853 (30min) -> Room temp (10-15min) | Same as 8.3 |
| 8.5 | Salt Spray | 353, 51% solution. 8 hours after plating, 24 hours before plating | Appearance: No damage; Contact Resistance: 30m |
| 8.6 | Solder ability | Solder Temperature: 2455, Immersion: 30.5S | Area of Soldering: 90% |
| 8.7 | Resistance to soldering heat | Manual: 30.5S at 3505; Wave: 50.5S at 2305; Reflow: Max 20S at 2555 | Appearance: No damage |
| No. | Item | SMT Lead-free Process Temperature Curve |
|---|---|---|
| 9.1 | SMT Lead-free Process Temperature Curve | Refer to diagram (not provided in text) |
Packaging: Terminals in disc loading material packaging; Plastic shells in plastic bags; Connectors in tape reels, bags, or tubes, with certificates indicating product name, specifications, quantity, and production date. Exterior packaging is cartons with packing lists.
Transportation: Any vehicle can be used, protected from moisture and mechanical damage. Transport temperature: -20~+50.
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