Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key
science and innovation-based manufacturing enterprise cultivated by
the local government. Focusing on semiconductor packaging and
testing, MEMS micro-electromechanical devices, as well as
optoelectronic and environmental sensors, the company integrates
research and development, design, large-scale production and sales,
with its core business serving three major tracks: automotive
electronics, intelligent equipment and industrial Internet of
Things.
1. The company specializes in customized packaging services for
mainstream plastic packaging products including BGA, LGA, DFN and
QFN, as well as PLCC and MEMS micro-electromechanical devices. It
has built a core technical team with extensive practical industrial
experience and established a nationwide market service network
through branches across multiple regions. As a highly promising
backbone player within Chongqing’s semiconductor industrial
cluster, it focuses on customized solutions featuring high
reliability, small-batch and multi-batch production, which
precisely meet stringent technical requirements for vehicle-mounted
and industrial scenarios, forming core competitive advantages that
distinguish it from large industrial manufacturers.
2. The company delves deep into advanced packaging and sensor
integration processes. Its self-developed micro-module connection
technology and high-precision sensor packaging technology have been
successfully applied in industrial inspection, vehicle-mounted
environment perception and other scenarios, providing low-cost,
high-reliability pilot test and mass production packaging channels
for small and medium-sized chip design enterprises. Meanwhile,
leveraging the R&D mechanism for high-tech enterprises, the
company continuously shares technical practices such as process
optimization and yield improvement with the industry, serving as a
technical demonstration platform for the segmented semiconductor
sector in Southwest China.
3. The company has successively been awarded titles including
National High-tech Enterprise, National Science and
Technology-based Small and Medium-sized Enterprise, and Provincial
Specialized, Refined, Unique and Innovative Small and Medium-sized
Enterprise. It maintains important cooperative ties with the
Chinese Academy of Sciences and holds dozens of patents, trademarks
and administrative licenses in total. Supported by solid technical
reserves and compliant operation capabilities, it ranks among
top-quality local enterprises in Chongqing’s microelectronics and
sensor industries. Committed to basing its operations in Chongqing,
expanding nationwide and connecting with global markets, the
company aims to become a benchmark specialized, refined, unique and
innovative enterprise in automotive electronic packaging & testing
and MEMS sensor sectors across Southwest China. It strives to build
an integrated industrial ecosystem featuring "independent R&D,
intelligent manufacturing and full-range services", break certain
import technical barriers in advanced packaging and industrial
sensing fields, and grow into a hidden champion with core pricing
power and technological leadership within its segmented tracks.