RGB Rolling Shutter 2.0 USB Camera Module 70 Perspective 5 MP With OV5648 Sensor

5MP RGB Rolling Shutter 70 Perspective USB 2.0 Camera Module With OV5648 Sensor , Customization Services Available .

1.Basic Parameters:

- Resolution: 2592 (H) × 1944 (V), 5 MP; maximum frame rate reaches 15 fps at full resolution, accommodating varying frame rate and image quality requirements across devices.
- Pixel dimensions: 1.4 µm (H) × 1.4 µm (V). The small-pixel configuration reduces the sensor volume, meeting miniaturization module requirements.
- Optical format: 1/4 inch, featuring a compact chip size that accommodates ultra-thin module designs and is compatible with mainstream lenses, meeting the structural installation requirements of miniaturized electronic devices.
- Power supply voltage: The operating voltage is 5V, ensuring stable performance under appropriate voltage conditions and guaranteeing sensor reliability.

- Temperature range: The operating temperature spans from 0°C to 50°C, offering a wide temperature range that accommodates various operating environments.

2.Technical Features:

- Curtain shutter technology: Featuring a line-by-line exposure curtain shutter design, it delivers low imaging noise and fine detail reproduction, with high circuit integration, optimized power consumption and cost efficiency, making it ideal for high-definition imaging in static or low-speed scenarios.
- Equipped with a back-illuminated imaging sensor technology, it achieves a minimum illuminance of just 0.1 lux, delivering clear images in low-light environments without requiring additional lighting. The built-in hardware HDR wide dynamic range algorithm delivers a dynamic range of up to 68 dB, effectively balancing overexposure in bright conditions and complete darkness in dim environments. This ensures superior image depth and detail even under complex lighting scenarios such as backlighting or high contrast lighting conditions.
- Featuring an integrated one-stop image processing algorithm that combines automatic exposure control (AEC), automatic white balance (AWB), autofocus (AF), black level calibration, and image sharpening capabilities. This eliminates the need for external DSP image processing chips to achieve basic image optimization, simplifying backend hardware circuit design and reducing overall development costs and timeframes. Additionally, it supports zero-latency shutter (ZSL) mode for instant, delay-free captures, effectively preventing motion blur in dynamic scenes.
- OV5648 Camera Module: Compatible with standard modules for various lens configurations including 70mm, meeting diverse customer requirements.

3. Application Areas:

Used in biometrics, drones, smart homes, IoT devices, machine vision, barcode scanning, factory automation, and other fields.

4. Personalized Customization Services:

The modular design enables tailored production according to client specifications, delivering customized solutions that meet specific needs.

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.