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Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution

Categories Electronics X Ray Machine
Model Number: AX8300MAX
Tube Type: Sealed
MOQ: 1Set
Delivery Time: 30 days
Power Consumption: 900W
Payment Terms: T/T,L/C
Motion Control Mode: Mouse & Keyboard & Joystick
System OS: Windows11 64-bit
Price: can negotiate
Tilt and Rotation: Detector unilateral tilt maximum 60°
Monitor: 27"HD 4K display
Supply Ability: 30 sets per month
Model: AX8300MAX
Brand Name: UNICOMP
Certification: CE, FDA
Place of Origin: China
Packaging Details: Wooden Case, Waterproof, Anti-collision
Company Info.
Unicomp Technology
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Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution

Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP
This advanced industrial X-ray inspection system delivers ultra-high 5μm detection resolution for precision analysis of IGBT solder voiding and comprehensive quality verification of electronic components and industrial workpieces.
Applications
Quality verification of semiconductor packaging devices including BGA, CSP, LED and flip chip, automotive electronic components, new energy core parts, aluminum die castings, injection molding plastic assemblies, ceramic structural components and other special industrial workpieces.
Key Features
  • Dedicated hardware configurations optimized for precision electronic inspection
  • Ultra-high 5μm detection resolution for precise capture of micro internal defects
  • Wide-coverage detection field supporting efficient batch inspection
  • High-precision dual-rocker mechanical control system for flexible positioning
  • Compatible with standard 2D flaw scanning and 2.5D contour detection
  • Expandable interfaces for 3D detection upgrade
  • Dual-screen interactive operation design for multi-task parallel operation
  • Professional AI detection algorithms for automatic identification of common internal defects
Technical Specifications
Product NameAX8300MAX
Dimension1286(W)*1540(D)*1700(H)[mm]
Machine Weight1530kg
Power Supply220V±10% 50Hz/60Hz 4A
DetectorHigh resolution FPD
Voltage110kV
Power900w
Tube TypeSealed
Max. Power25W
Detection Area129*129[mm]
Pixel Matrix1536*1536[pixel]
Frame RatesMax 30fps
Geometric Magnification47.7X
Functions and Features
UNICOMP AX8300MAX X-ray inspection machine functions and features diagram
Inspection Images
Sample inspection images from UNICOMP AX8300MAX X-ray system
Dimensions and Appearance
UNICOMP AX8300MAX X-ray inspection machine dimensions and appearance
Frequently Asked Questions
What's your packaging solution? Will the equipment stay intact during transit?
All X-ray inspection systems are securely packed in standard solid wooden cases to guarantee safe transportation.
What is your warranty policy and after-sales support?
We offer a 1-year warranty covering free spare parts replacement, alongside lifetime technical support. Our dedicated after-sales team is on standby; operation tutorial videos will also be provided to resolve any operational issues.
Can we receive free training if we visit your factory?
Absolutely. You are cordially invited to our manufacturing plant, and we will arrange full free professional training for your team.
Our Services
  • Conduct project analysis and customize targeted non-destructive inspection solutions
  • Deliver full-spectrum professional testing schemes tailored to diverse industrial demands
  • Offer professional fixture customization supported by experienced engineering team
  • Provide 24-hour email response service for all client inquiries
  • Support complimentary sample inspection testing
  • Supply real-time shipment tracking & logistics information verification
  • Cover 1-year standard warranty and lifelong technical maintenance service
Buy Semiconductor BGA Flip Chip Inspection X-ray AX8300MAX UNICOMP 5μm Minimum Resolution at wholesale prices
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