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| Categories | ICS Triplex |
|---|---|
| Model Number: | T8300C (official Rockwell documentation reference: T8300) |
| Brand Name: | ICS Triplex |
| Company Info. |
| AMIKON LIMITED |
| Verified Supplier |
| View Contact Details |
| Product List |
| ◇ Product overview | ▦ Specifications | ↔ Configuration | ? Model FAQ |
The Trusted Expander Chassis houses Trusted Expander Processors and Trusted input/output modules. Its Inter-Module Bus backplane provides the electrical interconnections and services required by modules installed in an expander chassis. The layout is designed for orderly system expansion while retaining the connection architecture required by the Trusted platform.
12 single-width I/O module slots | 2 Expander Processor slots | 20–32 V DC external supply range | 0–60 °C operating temperature |
▦ Adds I/O capacity Provides positions for up to twelve 30 mm single-width Trusted I/O
modules. | ↔ Connects the backplane The IMB backplane carries the module interconnections and
associated chassis services. | ⚡ Supports redundant power Two external 24 V DC connections supply dual-redundant power to
chassis modules. |
| External voltage range | 20 to 32 V DC |
| External fusing | 20 A |
| Expander communications | 30 m with TC-301 copper cable; up to 10 km with fibre converters |
| Operating temperature | 0 to +60 °C |
| Non-operating temperature | −25 to +70 °C |
| Relative humidity | 10% to 95%, non-condensing |
| Dimensions (H × W × D) | 268 × 483 × 312 mm |
| Weight | 5 kg |
| 01 | Match software to hardware. The System Configuration Tool layout must match the physical chassis and module positions. |
| 02 | Verify the interface path. Use the applicable Trusted Expander Interface, Expander Processor modules and specified cabling. |
| 03 | Confirm addressing and cooling. All three DIP-switch address settings must agree. Allow at least 90 mm between chassis for convection cooling. |
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