Custom PCBA Contract Manufacturing Gold Plating Contract Electronic Assembly

HTF provides custom contract manufacturing PCB assembly services with comprehensive surface finish options including HASL, OSP, ENIG, and gold plating for 1 to 20 layer multilayer boards manufactured on FR4, CEM1, CEM3, ceramic, and aluminum base materials with 0.5-6OZ copper thickness, board thickness 0.4-6mm, board size up to 541 by 647mm standard extending to 950mm special, precision fabrication with 0.15mm minimum hole size and 0.15mm / 3-4mil minimum line width and spacing, and complete PCB OEM fabrication, PCB design, and PCB assembly contract manufacturing services. The comprehensive surface finish portfolio provides the complete range of PCB pad surface options for the diverse component technologies, soldering processes, reliability requirements, and cost targets of contract manufacturing customers across industries. HASL hot air solder leveling provides the traditional cost-effective surface finish with good solderability, proven reliability, and excellent shelf life for contract manufacturing of boards with standard SMT components, through-hole connectors, and larger package sizes. OSP organic solderability preservative provides the most economical surface finish for high-volume contract manufacturing where the short interval between PCB fabrication and assembly enables the thinner organic coating to provide adequate protection at the lowest cost per board. ENIG electroless nickel immersion gold provides the flat pad surfaces essential for fine-pitch BGA, QFN, and LGA packages with excellent shelf life for boards that may be inventoried between fabrication and assembly in contract manufacturing programs with staggered production schedules, and the wire bonding capability for chip-on-board and hybrid circuit applications. Gold plating provides thicker gold deposits on edge connector fingers for the durability required by boards that are repeatedly inserted and removed, with the hard gold alloy providing wear resistance through hundreds or thousands of mating cycles in test, development, and field-serviceable equipment. The 1 to 20 layer range and 541 by 647mm board size with 950mm special capability accommodate the complete spectrum of contract manufacturing board requirements while the precision fabrication specifications enable the high-density designs common in modern electronics. PCB OEM fabrication builds boards to customer Gerber files and specifications, PCB assembly provides complete component procurement and assembly to customer bill of materials, and PCB design service supports customers requiring design development before manufacturing. The combination of comprehensive surface finishes with complete contract manufacturing services provides the one-stop manufacturing solution for electronics companies.

• Complete Surface Finish Portfolio: HASL, OSP, ENIG, and gold plating providing the full range of pad surface options for all component technologies and applications.
• HASL Cost-Effective Standard: Traditional finish with proven reliability for standard SMT and through-hole components in cost-sensitive contract manufacturing.
• OSP Economic Option: Lowest cost finish for high-volume contract manufacturing with short fabrication-to-assembly intervals maximizing cost efficiency.
• ENIG Fine-Pitch Excellence: Flat pads for BGA, QFN, LGA with excellent shelf life and wire bonding capability for advanced packaging applications.
• Gold Plating Edge Durability: Hard gold on connector fingers for hundreds to thousands of mating cycles in test and field-serviceable equipment.
• Complete Contract Manufacturing: PCB OEM fabrication, PCB assembly with procurement, and PCB design service from one source.
• Full Manufacturing Range: 1-20 layers, 541 x 647mm to 950mm, 0.15mm hole, 0.15mm / 3-4mil line/space, ±5% impedance for all requirements.

HTF custom contract manufacturing with comprehensive surface finishes serves the diverse board requirements of electronics companies across industries. Contract manufacturing customers with mixed product portfolios spanning consumer, industrial, automotive, and medical products where different surface finishes are optimal for different products benefit from the single-source contract manufacturing with all finish options, eliminating the need to qualify different PCB suppliers for products requiring different surface finishes. High-reliability electronics for aerospace, defense, medical, and automotive applications where ENIG surface finish is the standard for fine-pitch BGA components and product lifecycles of 10 years or more requiring boards to remain solderable after extended storage utilize our ENIG contract manufacturing with the process control and documentation for regulated industry requirements. Cost-sensitive high-volume consumer and commercial electronics where OSP or HASL surface finishes provide the optimal balance of manufacturing cost and solderability for products with short fabrication-to-assembly intervals in high-volume production benefit from the cost efficiency of our OSP and HASL manufacturing. Modular electronics systems with plug-in boards requiring gold-plated edge connector fingers for mating with backplane connectors in card cage and chassis-based equipment including telecommunications, industrial control, and test and measurement systems depend on our gold plating contract manufacturing for the durable edge contacts in these applications. PCB design service customers developing new products benefit from the surface finish selection guidance during the design phase, ensuring the optimal finish is specified for each product component technology, manufacturing process, and reliability requirements before manufacturing begins.

Every assembly individually packaged in standard anti-static protective packaging at 20.0 by 10.0 by 10.0 centimeters with approximately 1.0 kilogram gross weight. Complete contract manufacturing documentation with surface finish specifications, fabrication records, and certificates of conformance. HTF quality manufacturing from Guangdong, China.