HTF operates as a custom OEM SMT PCBA manufacturer delivering FR4
multilayer PCB assembly with one stop turnkey service from our
ISO/TS16949/RoHS certified facility in China. Our custom OEM
manufacturing model provides product companies and electronics
brands with tailored PCB assembly solutions that match their exact
specifications rather than adapting to off-the-shelf manufacturing
templates with compromises. We support FR4 multilayer constructions
up to 48 layers with board thickness from 0.2mm to 6mm, copper
weights from 0.5oz to 6oz, and precision manufacturing down to
0.15mm line width with 3-4mil line spacing for fine-pitch component
compatibility. Beyond standard FR4, our material portfolio includes
CEM1 and CEM3 for cost-optimized single and double-sided consumer
products, and high-frequency laminates for RF and high-speed
digital applications. The one stop turnkey service encompasses
design review, component procurement management, SMT and
through-hole assembly, comprehensive testing to IPC-A-600
standards, and logistics coordination, with every project receiving
a 2-hour quotation and 24-hour technical support throughout the
production cycle from our dedicated engineering team.
Key Features- Custom OEM Manufacturing Flexibility: Fully tailored PCB assembly solutions configured to your exact
specifications including board dimensions from rectangular to
complex shapes with slots and cutouts, layer count from
single-sided to 48-layer multilayer, material selection across FR4,
CEM1, CEM3, and high-frequency substrates, surface finish choice
between HASL, ENIG, and OSP, and solder mask color in green, black,
blue, red, or matt green.
- 48-Layer Advanced Multilayer Capability: Industry-leading 48-layer PCB assembly support with controlled
impedance structures, blind and buried via technology,
back-drilling for signal integrity optimization, and fine-line
etching down to 0.15mm enabling complex high-density interconnect
designs demanded by modern telecommunications infrastructure,
aerospace systems, and high-performance computing platforms.
- Comprehensive Material Selection: Access to standard FR4 for general applications, CEM1 and CEM3 for
cost-effective consumer electronics, and high-frequency board
materials for RF, microwave, and high-speed digital applications,
with copper weights from 0.5oz for fine-line signal routing to 6oz
for high-current power distribution on the same multilayer board.
- Multiple Surface Finish Options: HASL for economical general-purpose applications, ENIG for
superior oxidation resistance and extended shelf life with
excellent wire bonding capability, and OSP for flat pad surfaces
optimized for fine-pitch SMT component placement, selected based on
your specific assembly and end-use requirements.
- Multi-Format Design File Support: Accept Gerber files, PROTEL 99SE, PROTEL DXP, CAM350, and ODB++
(.TGZ) formats for seamless integration with diverse customer
design environments, eliminating the need for file format
conversion that can introduce errors or delay project initiation in
multi-team development environments.
- IPC-A-600 Fabrication Quality: All bare PCB fabrication adheres to IPC-A-600 Class 2
acceptability standards with documented inspection covering etch
definition, hole wall quality, solder mask registration, legend
legibility, and surface finish uniformity, providing the quality
foundation necessary for reliable SMT and through-hole assembly
results.
- ISO/TS16949/RoHS Triple Certification: Manufacturing operations governed by ISO quality management,
TS16949 automotive-grade process control with failure mode effects
analysis and statistical process monitoring, and RoHS compliance
verified through XRF material analysis, ensuring products meet
regulatory requirements for all major global markets.
Technical Specifications| Parameter | Specification |
|---|
| Base Material | FR4 / CEM1 / CEM3 / High Frequency Board |
| Board Thickness | 0.4-6mm |
| Copper Thickness | 0.5-6OZ |
| Min. Hole Size | 0.25mm (10mils) |
| Min. Line Width / Spacing | 0.15mm / 3-4mil |
| Surface Finishing | HASL / ENIG / OSP |
| Max Layer | 48L |
| PCB Standard | IPC-A-600 |
| Solder Mask | Green, Black, Blue, Red, Matt Green |
| Certification | ISO / TS16949 / RoHS |
ApplicationsOur custom OEM SMT PCBA manufacturing service serves diverse
industries where tailored PCB assembly solutions and reliable
supply chain management are essential for product success. Consumer
electronics brands utilize our OEM service for smart home device
controllers, wireless audio product main boards, portable power
bank PCBs, and IoT sensor hub assemblies where custom board shapes,
compact form factors, and consistent manufacturing quality across
production volumes directly impact retail product performance and
customer satisfaction. Power electronics manufacturers depend on
our heavy copper capability up to 6oz for motor drive inverter
boards, power supply controller PCBs, solar inverter interface
assemblies, and UPS system control modules where high-current
traces must coexist with fine-pitch control circuitry on the same
multilayer board without compromising either function. LED lighting
companies leverage our aluminum substrate and FR4 capability for
LED driver boards, smart lighting controller PCBs, DMX interface
modules, and architectural lighting control assemblies where
thermal management and long-term reliability are critical
performance requirements for products expected to operate for tens
of thousands of hours. Security and surveillance equipment
manufacturers partner with us for IP camera main boards, NVR/DVR
processing PCBs, access control system controller assemblies, and
intercom interface modules where the 48-layer capability supports
the high-density digital processing and multiple high-speed
interfaces required by modern multi-channel video surveillance and
access management systems.
Packaging & Quality AssuranceEach PCB assembly is individually vacuum-sealed in anti-static
moisture barrier packaging with desiccant and humidity indicator
cards, then placed in protective cartons measuring 10.0cm x 15.0cm
x 10.0cm with approximately 0.5kg gross weight per single unit. Our
ISO/TS16949 certified quality management system enforces rigorous
process controls at every manufacturing stage: incoming material
verification including laminate quality and copper foil thickness
inspection, in-process dimensional checks, post-etch trace width
verification through automated optical inspection, solder mask
registration and cure integrity testing, surface finish thickness
measurement via X-ray fluorescence spectroscopy, and comprehensive
electrical testing including flying probe continuity verification
and isolation resistance measurement. All products are manufactured
to IPC-A-600 acceptability standards for printed boards with
documented inspection records. RoHS compliance is verified through
XRF material analysis. Complete traceability linking each board to
component lots and process parameters is maintained, with 24-hour
technical support available for all customer inquiries and a
quotation turnaround within 2 hours for new project evaluations.