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| Categories | PCBA |
|---|---|
| Placement Accuracy: | ±0.05mm |
| Place of Origin: | China |
| SMD Configuration: | Single-sided / Double-sided |
| Certification: | ISO9001 |
| Assembly Technology: | Surface Mount Technology (SMT) |
| Price: | negotiate |
| SMT Component Types: | ICs, resistors, capacitors, BGAs |
| Delivery Time: | 15-30 Days |
| Brand Name: | Jiaqing Circuit |
| Payment Terms: | L/C,D/A,D/P,T/T |
| Company Info. |
| Shenzhen Jiaqing Circuit Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
This High Density Interconnect (HDI) PCBA is designed for the most demanding miniaturized electronics applications. Featuring fine lines and spaces (0.075mm/0.075mm), micro-vias (0.1mm diameter), and multiple build-up layers, HDI technology enables significantly higher component density than conventional PCBs. This assembly is ideal for advanced smartphones, AI computing modules, memory modules, and high-performance computing applications. The HDI process incorporates sequential lamination, laser drilling, and advanced plating techniques to achieve the interconnect density required by today's most advanced semiconductor packages.
Technical Specifications| Parameter | Specification |
|---|---|
| Technology | High Density Interconnect (HDI) |
| Minimum Line Width/Space | 0.075mm / 0.075mm |
| Minimum Via Diameter | 0.1mm (laser microvia) |
| Via Types | Blind, Buried, Stacked, Staggered |
| Layer Structure | Sequential build-up (1+N+1, 2+N+2, etc.) |
| Board Types | Rigid, Flex, Rigid-Flex |
| Component Types | Fine-pitch BGAs, CSPs, POPs |
| Application Areas | Smartphones, AI modules, Memory, HPC |
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