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Dye System Acid Copper Plating Additives Dye Based Acid Copper Plating Process

Categories Copper Plating Additives
Model Number: 2000
Pure Sulfuric Acid: 27-38 mL/L
Payment Terms: T/T
Cathode Current Density: 1-6 A/dm²
MOQ: 25-30kg
Operating Temperature: 20-30 ℃
Packaging Details: 25kg/drum
Anode Current Density: 0.5-2.5 A/dm²
Brand Name: AOBANG
Copper Sulfate Pentahydrate: 195-255 g/L
Place of Origin: China
Delivery Time: 5-8 work day
Chloride Ion: 80-150 mg/L
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Dye System Acid Copper Plating Additives Dye Based Acid Copper Plating Process

RUBIN F 2000 Dye-Based Acid Copper Process

Performance & Features

  1. Dye-system acid copper plating additive.
  2. Low internal stress and excellent ductility of deposits.
  3. Wide temperature tolerance, stable operation above 30 ℃.
  4. Outstanding leveling and throwing power.

Operating Parameters

ItemConcentration Range
Copper Sulfate Pentahydrate (CuSO₄·5H₂O)195–255 g/L
Pure Sulfuric Acid (SG=1.84 g/mL)27–38 mL/L
Chloride Ion (Cl⁻)80–150 mg/L
2000 Make-Up Agent8–10 mL/L
2000 A Leveler0.4–0.6 mL/L
2000 B Brightener0.3–0.6 mL/L
Operating Temperature20–30 ℃
Cathode Current Density1–6 A/dm²
Anode Current Density0.5–2.5 A/dm²
Anode MaterialPhosphor copper balls (0.03–0.06% P)
Operating Voltage1.0–6.0 V
AgitationAir agitation + mechanical agitation
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