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| Categories | Double Layer Printed Circuit Board |
|---|---|
| Model Number: | XSWPCB |
| Material: | PI |
| MOQ: | 1 |
| Delivery Time: | 8-15DAYS |
| Surface Finish: | OSP |
| Payment Terms: | Western Union |
| Supply Ability: | 1 Million Square feet/per month |
| Certification: | UL ,IOS9000 |
| Board Thickness: | 0.6 mm (Customizable) |
| Place of Origin: | China |
| Copper Thickness: | 1/1 oz |
| Price: | Negotiable |
| Brand Name: | XSW PCB |
| Layer Count: | 2-Layer |
| Company Info. |
| Shenzhen Xunsiwei Circuit Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Double Layer Flexible PCB Assembly 0.5mm Thickness UL Certified
This double-layer flexible printed circuit board (FPC) features an overall thickness of 0.5mm and complies with UL safety certification standards. Manufactured with high-quality polyimide base material, the flexible PCB supports double-sided circuit routing with reliable plated through holes for electrical interconnection between top and bottom conductive layers. It can be bent, folded and shaped to fit compact, irregular device enclosures. Widely applied in consumer electronics, display modules, smart wearable devices, medical equipment and automotive internal wiring assemblies. Custom layouts, surface finishes and connector pads are available to meet individual project requirements.
| Layer Count | 2-Layer |
| Material | Polyimide (PI) |
| Board Thickness | 0.6mm (Customizable) |
| Copper Thickness | 0.5/0.5 oz |
| Minimum Hole Size | 0.1 mm |
| Minimum Line Width | 0.1 mm |
| Minimum Line Spacing | 0.1 mm |
| Solder Mask Color | Yellow |
| Surface Finish | OSP |
Product Description
1.Double-layer circuit design with plated through vias for
interlayer connectivity
2. Ultra-slim 0.6mm total thickness, saving internal product space
3. UL certified material & manufacturing, meets international
safety standards
4. Excellent flexibility, capable of dynamic bending and static
folding installation
5. High tensile polyimide substrate, outstanding heat resistance
and dimensional stability
6. Stable electrical performance, suitable for high-density signal
transmission
7. Supports various surface treatments: ENIG, HASL, OSP, immersion
silver
8. Customizable outline, pad layout, stiffener and gold finger
design
9. Lightweight structure compared with rigid PCBs, effectively
reducing product weight
10. RoHS compliant, eco-friendly lead-free production available
| Item | Mass Production Capability | Extreme Capability |
|---|---|---|
| Board Thickness Range | 0.3~6.0mm | 0.3~6.0mm |
| Exposure Alignment Accuracy | ±0.015mm | ±0.005mm |
| Minimum Annular Ring | Single side ≥0.05mm | Single side ≥0.05mm |
| Min Line Width/Space (1/3oz base copper) | 0.05mm / 0.05mm | 0.045mm / 0.045mm |
| Min Line Width/Space (1/2oz base copper) | 0.05mm / 0.05mm | 0.05mm / 0.05mm |
| Min Line Width/Space (1oz base copper) | 0.075mm / 0.075mm | 0.075mm / 0.075mm |
| Etching Tolerance (1/3oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1/2oz base copper) | ±0.005mm | ±0.005mm |
| Etching Tolerance (1oz base copper) | ±0.0075mm | ±0.0075mm |
| Gold Finger Total Pitch Tolerance | <30mm: ±0.05mm 30~60mm: ±0.075mm | <30mm: ±0.03mm 30~60mm: ±0.05mm |
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