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EMS Drone Flight Controller PCB Drone Receiver Circuit Board MINI Control PCB Assembly

Categories Drone PCB Board
Model Number: XSWPCB
Material: FR-4
MOQ: 1
Delivery Time: 8-15DAYS
Surface Finish: Black
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Certification: UL ,IOS9000
Board Thickness: 1.6 mm (Customizable)
Place of Origin: China
Copper Thickness: 1/1/1/1/1/1 oz
Price: Negotiable
Brand Name: XSW PCB
Layer Count: 6-Layer
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EMS Drone Flight Controller PCB Drone Receiver Circuit Board MINI Control PCB Assembly

EMS Drone Flight Controller PCBA Board Drone Receiver Circuit Board MINI Control PCB Assembling Manufacturer


The EMS Drone Flight Controller PCBA Board and Drone Receiver Circuit Board is a compact, high-performance electronic control solution designed for UAV flight management, wireless communication, navigation systems, and autonomous drone operations. Manufactured through professional Electronic Manufacturing Services (EMS), this MINI control PCB integrates advanced circuit design, precision SMT assembly, and comprehensive testing to ensure stable and reliable drone performance.


Key Specifications
Layer Count6-Layer
MaterialFR-4
Board Thickness1.6 mm (Customizable)
Copper Thickness1/1/1/1/1/1 oz
Minimum Hole Size0.2 mm
Minimum Line Width0.1 mm
Minimum Line Spacing0.1 mm
Solder Mask ColorBlack
Surface FinishHASL

Product Description

  • Compact MINI PCB Design
    • Lightweight and space-saving structure for modern UAV systems.
    • Ideal for compact drones and portable aerial devices.
  • Integrated Flight Control Functionality
    • Supports flight stabilization, navigation, and motion control.
    • Enables precise UAV operation and responsive flight performance.
  • Reliable Drone Receiver Circuit
    • Optimized RF signal reception and communication stability.
    • Supports real-time command transmission and telemetry data exchange.
  • Professional EMS Manufacturing Service
    • Complete PCB fabrication, component sourcing, SMT assembly, and testing.
    • Provides efficient one-stop production solutions.
  • High-Density SMT Assembly
    • Supports miniature ICs, sensors, microcontrollers, and RF modules.
    • Ensures precise component placement and assembly quality.
  • Excellent Signal Integrity
    • Optimized circuit layout minimizes noise and signal interference.
    • Improves communication reliability and control accuracy.
  • Design Specifications
ItemMass Production CapabilityExtreme Capability
Board Thickness Range0.3~6.0mm0.3~6.0mm
Exposure Alignment Accuracy±0.015mm±0.005mm
Minimum Annular RingSingle side ≥0.05mmSingle side ≥0.05mm
Min Line Width/Space (1/3oz base copper)0.05mm / 0.05mm0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)0.05mm / 0.05mm0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)0.075mm / 0.075mm0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)±0.005mm±0.005mm
Etching Tolerance (1/2oz base copper)±0.005mm±0.005mm
Etching Tolerance (1oz base copper)±0.0075mm±0.0075mm
Gold Finger Total Pitch Tolerance<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
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