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12 Layer Multilayer HDI Printed Circuit Board High Density Electronics PCB Manufacturing

Categories HDI Printed Circuit Board
Model Number: XSWPCB
Material: FR-4
MOQ: 1
Delivery Time: 8-15DAYS
Surface Finish: OSP
Payment Terms: Western Union
Supply Ability: 1 Million Square feet/per month
Certification: UL ,IOS9000
Board Thickness: 1.0mm (Customizable)
Place of Origin: China
Copper Thickness: 1/1/1/1/1/1/1/1/1/1oz
Price: Negotiable
Brand Name: XSW PCB
Layer Count: 12-Layer
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12 Layer Multilayer HDI Printed Circuit Board High Density Electronics PCB Manufacturing

12 Layer Multilayer HDI PCB with Stacked Blind Vias for High-Density Electronics

The manufacturing process focuses on precise dual-laser alignment control. First- and second-stage blind vias are formed through sequential laser drilling, with cumulative microvia offset maintained within ≤25μm. Each laser drilling system is monitored through Statistical Process Control, maintaining a process capability index (CPK) of ≥1.33 to ensure consistent production quality.

To optimize black solder mask performance, exposure energy grid testing is conducted before production. The process ensures complete development and eliminates residue inside blind vias, preventing reliability issues during assembly.

Key Specifications
Layer Count12-Layer
MaterialFR-4
Board Thickness1.0 mm (Customizable)
Copper Thickness2/1/1/1/1/1/1/1/1/1/1/2 oz
Minimum Hole Size0.1 mm
Minimum Line Width0.1 mm
Minimum Line Spacing0.1 mm
Solder Mask ColorBlack
Surface FinishOSP

Product Description

Advanced 2+N+2 HDI Structure

  • Two-step HDI architecture with stacked laser microvias.
  • Higher routing density for complex multilayer designs.
  • Supports miniaturized and high-performance electronic products.

Precision Dual-Laser Alignment Control

  • Sequential laser drilling process for stacked blind vias.
  • Cumulative blind-via offset controlled within ≤25μm.
  • Improves interconnection reliability and electrical performance.

High Process Capability Manufacturing

  • Laser drilling equipment maintained at CPK ≥1.33.
  • Stable production consistency across volume manufacturing.
  • Reduced variation and improved yield rates.

Black Solder Mask Optimization

  • Professional exposure energy grid testing before production.
  • Enhanced process control for black solder resist applications.
  • Suitable for high-density circuit patterns and fine-pitch designs.
  • Design Specifications
ItemMass Production CapabilityExtreme Capability
Board Thickness Range0.3~6.0mm0.3~6.0mm
Exposure Alignment Accuracy±0.015mm±0.005mm
Minimum Annular RingSingle side ≥0.05mmSingle side ≥0.05mm
Min Line Width/Space (1/3oz base copper)0.05mm / 0.05mm0.045mm / 0.045mm
Min Line Width/Space (1/2oz base copper)0.05mm / 0.05mm0.05mm / 0.05mm
Min Line Width/Space (1oz base copper)0.075mm / 0.075mm0.075mm / 0.075mm
Etching Tolerance (1/3oz base copper)±0.005mm±0.005mm
Etching Tolerance (1/2oz base copper)±0.005mm±0.005mm
Etching Tolerance (1oz base copper)±0.0075mm±0.0075mm
Gold Finger Total Pitch Tolerance<30mm: ±0.05mm
30~60mm: ±0.075mm
<30mm: ±0.03mm
30~60mm: ±0.05mm
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