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Heat-Resistant MPPO JEDEC IC Tray with Customizable Dimensions and Stable Structural Integrity

Categories JEDEC IC Trays
MOQ: 500
Delivery Time: 10 workdays
Incoterms: EXW, FOB, CIF, DDU, DDP
Clean Class: General And Ultrasonic Cleaning
Payment Terms: T/T
Reusable: Yes
Flatness: Less than 0.7mm
Model Number: HN25033
Color: Black
Certification: ROHS, ISO
Quality Assurance: Delivery Guarantee, Reliable Quality
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Mold Type: Injection
Capacity: 11X3=33 PCS
Place of Origin: China
Cavity Size: 21.04×28.42×2.72 mm
Supply Ability: 2000PCS/Day
Tray Shape: Rectangular
Packing Level: Transport package
Brand Name: Hiner-pack
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Packaging Details: CARTON, PALLET
Ic Type: BGA,QFP,QFN,LGA,PGA
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  • Product Details
  • Company Profile

Heat-Resistant MPPO JEDEC IC Tray with Customizable Dimensions and Stable Structural Integrity

Durable JEDEC IC Trays in Heat-Resistant MPPO for Stable Protection
JEDEC IC Tray is built for semiconductor packaging, crafted from heat-resistant MPPO material to withstand high temperatures while maintaining long-lasting structural stability. Its rigid design shields delicate ICs from shocks, dust, and moisture during storage and transport.

JEDEC IC Tray adapts to unique needs with fully customizable dimensions, cavity layouts, and branding options. Whether standard JEDEC formats or tailored configurations are required, it aligns perfectly with production and logistics workflows.

JEDEC IC Tray is trusted across semiconductor manufacturing, testing, and distribution. Its heat-resistant properties make it ideal for high-temperature processes, while its durable build ensures reliable protection throughout the entire supply chain.
Key Features/ Benefits
  • Sturdy structural integrity
  • Effective dust prevention
  • Short delivery time and good quality.
  • Heat-resistant MPPO material for high-temperature processes
  • Fully customizable dimensions and cavity layouts

Specifications
BrandHiner-pack
ModelHN25033
MaterialMPPO
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6×135.9×8 mm
Cavity Size21.04×28.42×2.72 mm
Matrix QTY11X3=33 PCS
WarpageMAX 0.7mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
JEDEC IC Tray is widely used in semiconductor wafer fabrication, IC testing, and final assembly lines. Its heat-resistant MPPO material makes it perfect for high-temperature processes like die attach and reflow soldering.

It also serves logistics and distribution teams, providing secure, stackable storage for finished ICs. Its customizable design ensures compatibility with automated handling systems, streamlining supply chain operations.
Customized Services
JEDEC IC Tray offers full customization for every design aspect. Adjust cavity size, pitch, and layout to match component dimensions. Add custom logos, part numbers, or anti-static markings for brand consistency.

The engineering team works closely with clients to optimize tray performance for specific applications. Whether small-batch prototypes or large-scale production runs are needed, tailored solutions enhance efficiency and protect valuable semiconductors.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
Buy Heat-Resistant MPPO JEDEC IC Tray with Customizable Dimensions and Stable Structural Integrity at wholesale prices
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