High-speed fully automatic solder paste printer, suitable for PCB and CPH SMT production lines.

OK-SASPP-600-H High Speed Fully Automatic Solder Paste Printer

The OK-SASPP-600-H is engineered for maximum throughput in high-volume SMT production environments. With a class-leading 8-second cycle time and capacity exceeding 3,000 CPH, this printer eliminates the stencil printing bottleneck that plagues many high-speed pick-and-place lines.

Key Features

• 8-Second Cycle Time: Optimized motion control with high-speed servo drives minimizes board handling, alignment, and printing overhead
• 3,000 Plus CPH Throughput: Dual-lane conveyor supports continuous board flow with zero-wait changeover
• Fast Vision Alignment: Mark point recognition completes optical alignment in under 1 second
• Automatic Stencil Cleaning: Integrated dry/wet/vacuum cleaning with programmable frequency keeps stencil apertures clear
• PCB Warp Compensation: Auto-leveling Z-axis with 4-point height sensing compensates for board warpage up to 3mm
• Quick Changeover: Tooling-free rail adjustment and recipe recall enable line changeover in under 3 minutes

Technical Specifications

Applications

Ideal for high-volume consumer electronics manufacturing: smartphone mainboards, tablet PCBs, power bank modules, LED driver boards, and IoT device assembly where production speed directly impacts line profitability.

Packaging and Shipping

Export wooden crate packaging with PE moisture barrier and EPE cushioning. Shipping by sea in 15-25 days or air in 5-7 days. Installation and operator training available upon request.