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Durable JEDEC IC Trays for Dust-Free Semiconductor Packaging

Categories JEDEC IC Trays
Brand Name: Hiner-pack
Model Number: HN25006
Certification: ROHS, ISO
Place of Origin: China
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Delivery Time: 10 workdays
Packaging Details: CARTON, PALLET
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Color: Black
Quality Assurance: Delivery Guarantee, Reliable Quality
Cavity Size: 322.6x135.9x7.62 mm
Incoterms: EXW, FOB, CIF, DDU, DDP
Mold Type: Injection
Reusable: Yes
Tray Shape: Rectangular
Clean Class: General And Ultrasonic Cleaning
Ic Type: BGA,QFP,QFN,LGA,PGA
Packing Level: Transport package
Flatness: Less than 0.76mm
Capacity: 4x9=36 PCS
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  • Product Details
  • Company Profile

Durable JEDEC IC Trays for Dust-Free Semiconductor Packaging

Durable JEDEC IC Trays for Dust-Free Semiconductor Packaging
Shield delicate semiconductor components from dust and damage during packaging operations. Minimize contamination risks effectively. Built with durable structure to meet JEDEC standards for reliable industrial use. Seeking trusted tray solutions for secure semiconductor packaging?

Fit automated packaging lines and cleanroom environments perfectly. Perform steadily in component handling and packaging procedures. Adapt to diverse semiconductor packaging processes smoothly.

Enable safe component storage and logistics. Support custom designs to meet specific packaging demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.
Key Features/ Benefits
  • Deliver durable construction.
  • Reduce dust contamination.
  • Dust minimization.
  • Component protection.
  • Flexible customization.
Specifications
BrandHiner-pack
ModelHN25006
MaterialMPPO
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6x135.9x7.62 mm
Cavity Size16×9.5×4.72 mm
Matrix QTY4x9=36 PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Apply to semiconductor wafer level packaging, IC performance testing, die sorting, wafer fabrication, and device assembly. Adapt to cleanroom manufacturing, automated production lines, precision component handling, and high-temperature processing workflows. Ensure stable performance in strict dust-free environments.

Support component long-term storage, inter-factory logistics, production turnover, vacuum packaging, and sample shipment operations. Meet diverse requirements for semiconductor packaging, quality inspection, supply chain management, and electronic component distribution.
Packaging & Shipping/ Services
Offer targeted customization for JEDEC IC trays tailored to packaging and transportation needs. Collaborate closely with teams to design cavity shapes, anti-slip structures, and shock-absorbent materials for secure component handling during packaging and long-distance logistics. Develop anti-static or dust-sealed variants, and validate prototypes through vibration and drop tests. Deliver personalized tray solutions that safeguard semiconductor components throughout packaging, loading, and inter-factory or global shipment processes.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
Buy Durable JEDEC IC Trays for Dust-Free Semiconductor Packaging at wholesale prices
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