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Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging

Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging

Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging
Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging
Categories JEDEC IC Trays
Brand Name: Hiner-pack
Model Number: HN25023
Certification: ROHS, ISO
Place of Origin: China
MOQ: 500 pcs
Price: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Delivery Time: 10 workdays
Packaging Details: CARTON, PALLET
Tray Weight: Varies, Typically Up To 500 Grams Per Cavity
Color: Black
Quality Assurance: Delivery Guarantee, Reliable Quality
Cavity Size: 322.6×135.9×8.12 mm
Incoterms: EXW, FOB, CIF, DDU, DDP
Mold Type: Injection
Reusable: Yes
Tray Shape: Rectangular
Clean Class: General And Ultrasonic Cleaning
Ic Type: BGA,QFP,QFN,LGA,PGA
Packing Level: Transport package
Flatness: Less than 0.76mm
Capacity: 2X36=72PCS
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Company Info.
Shenzhen Hiner Technology Co., Ltd.
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Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging

Durable JEDEC IC Trays Protect Semiconductors and Reduce Dust in Packaging
Offer robust structural integrity to prevent IC shifting, scratches, and contamination. Built with heat-resistant MPPO material to withstand up to 150°C for stable industrial performance. Meet JEDEC standards for consistent reliability. Seeking durable trays for secure IC handling?

Integrate seamlessly with automated packaging lines and logistics workflows. Perform steadily in loading, transfer, and high-temperature processing procedures. Adapt smoothly to diverse semiconductor packaging and shipping scenarios.

Support fully customized cavity sizes and grid layouts to match specific IC dimensions. Prioritize clean production compatibility. Deliver tailored solutions that optimize packaging efficiency and protect ICs throughout transit.
Key Features/ Benefits
  • Deliver durable construction.
  • Reduce dust contamination.
  • Support small batch production in the first batch.
  • More than 12 years of export experience.
  • With professional engineers and efficient management.
Specifications
BrandHiner-pack
ModelHN25023
MaterialMPPO
Package TypeJEDEC
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size322.6×135.9×8.12 mm
Cavity Size48.51×4.04×0.84 mm
Matrix QTY2X36=72 PCS
WarpageMAX 0.76mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Serve semiconductor IC packaging, high-temperature assembly, cleanroom processing, and component storage operations. Compatible with automated handling systems, Class 100/1000 cleanrooms, and high-precision manufacturing lines.

Also utilized in inter-factory IC transfer, overseas logistics shipping, and finished component warehousing. Cater to IC manufacturers, packaging houses, and electronic component logistics providers.
Packaging & Shipping/ Services
Provide tailored solutions for IC packaging and transportation. Adjust cavity size, pitch, and layout to fit diverse IC dimensions for secure loading and transit. Leverage heat-resistant MPPO material to withstand 150°C processes. Ensure stable performance during long-distance shipping and automated packaging operations.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers
Product Tags:

JEDEC IC trays for semiconductors

  

dustproof JEDEC IC trays

  

durable semiconductor packaging trays

  
Buy Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging at wholesale prices

Heat-Resistant MPPO JEDEC IC Tray with Customizable Cavity Sizes for Semiconductor Packaging

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