Name: High Temp ESD Waffle Trays for Semiconductor ICs
Brand: Hiner-pack
Price: 1.35 USD

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High Temp ESD Waffle Trays for Semiconductor ICs

Categories	Waffle Pack Chip Trays
MOQ:	500 pcs
Delivery Time:	10 workdays
Incoterms:	EXW, FOB, CIF, DDU, DDP
Ic Type:	BGA,QFP,QFN,LGA,PGA
Model Number:	HN24199
Mold Type:	Injection
Capacity:	7x7=49 PCS
Certification:	ROHS, ISO
Brand Name:	Hiner-pack
Reusable:	Yes
Place of Origin:	China
Clean Class:	General And Ultrasonic Cleaning
Payment Terms:	T/T
Color:	Black
Cavity Size:	4.1x4x0.9 mm
Supply Ability:	2000PCS/Day
Tray Weight:	Varies, Typically Up To 500 Grams Per Cavity
Outline Line Size:	50.8×50.8×3.94 mm
Tray Shape:	Rectangular
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Quality Assurance:	Delivery Guarantee, Reliable Quality
Packaging Details:	CARTON, PALLET
Packing Level:	Transport package
Warpage:	Warpage MAX 0.2mm

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Company Info.

Shenzhen Hiner Technology Co., Ltd.

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Product Details
Company Profile

High Temp ESD Waffle Trays for Semiconductor ICs

Adopts high temperature resistant material and anti-static structure to provide stable performance in harsh production conditions. Effectively fixes semiconductor IC chips and avoids displacement or damage during high temp processing.

Works well in high temperature processing procedures and automatic production lines. Ensures stable placement of chips and maintains component integrity in continuous operation.

Supports customization of cavity size and arrangement to fit different IC specifications. Focuses on safe fixing and reliable protection to meet various semiconductor production requirements.

Key Features/ Benefits

ESD protection
High temperature resistance
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24199
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×3.94 mm
Cavity Size		4.1x4x0.9 mm
Matrix QTY		7x7=49 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suitable for high temperature semiconductor processing, chip baking, component testing and packaging procedures. Fits well in automatic production lines and high temperature working environments.

Applied in chip production, semiconductor packaging, electronic component processing and factory internal transportation. Widely used in semiconductor factories and electronic manufacturing plants.

Packaging & Shipping/ Services

Packed in standard cartons with inner protective layers to avoid scratches and deformation. Stacked safely for bulk transportation.

Supports sea, air and international express shipping. Ensures products arrive in good condition and ready for direct use in production.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

High Temp ESD Waffle Trays for Semiconductor ICs

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