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PANASONIC AXT340124

Categories Industrial Connectors
MOQ: 200
Model Number: AXT340124
Brand Name: PANASONIC
Contact Plating: Gold
Packaging Details: SMD,P=0.4mm
Mounting Type: Surface Mount,Vertical
Number of Pins: 40P
Delivery Time: 4-6 working days
Number of Rows: 2
Description: nan
Stock: 8522
Pitch: 0.4mm
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PANASONIC AXT340124

Notes on Using Narrow Pitch Connectors

These notes provide essential safety remarks and usage guidelines for narrow pitch connectors, including board-to-board and board-to-FPC applications. Adhering to these specifications is crucial to prevent circuitry damage, abnormal heating, smoke, fire, and to ensure the quality and reliability of Panasonic Corporation products.

Key Usage Guidelines:

  • Do not use connectors beyond their specified ratings (current, dielectric strength, environmental conditions).
  • Thorough specification review is recommended. Contact a sales representative for usage outside specifications.
  • When using board-to-board connectors, avoid connecting a pair of boards with multiple connectors to prevent misalignment and product breakage.
  • Design PC boards and patterns considering the performance and abilities of mounting equipment, accounting for positioning errors (up to 0.2-0.3 mm).
  • If connectors have positioning tabs, design PC boards with matching positioning holes.
  • Ensure PC boards meet recommended pattern design dimensions for mechanical strength during soldering.
  • Minimize cover lay thickness to prevent poor soldering, as connectors have no stand-off.
  • For narrow pitch series, design means to fix the PC board in place (e.g., with screws and spacers) to prevent detachment during vibrations or impacts.
  • When mounting connectors on an FPC, use a reinforcing plate on the backside to prevent solder detachment from terminals.
  • Consider measures to prevent mating separation due to dropping impact, especially for FPCs with temporary locking structures.
  • Handle connectors with care during mating to avoid displacement or angled mating, which can cause damage or deformation.
  • When selecting placement machines, consider connector height, positioning accuracy, and packaging. Avoid excessive chucking force.
  • Be aware of external forces applied to contact surfaces and terminals during mounting.
  • If self-alignment is not possible for larger connectors, carefully position the terminal with the PC board pattern.
  • For reflow soldering, measure recommended profile temperatures near the connector.
  • Use screen printing for cream solder. Ensure screen opening and PC board foot pattern areas align with specifications to avoid excess solder.
  • When mounting on the underside of a PC board, use adhesives or other means for proper fixing.
  • Consider solder and flux characteristics for wettability and reflow temperature settings.
  • Use automatic positioning machines for accurate connector placement, especially when positioning bosses are present.
  • In dry conditions, manage static electricity (recommended humidity 40-60% RH).
  • Avoid resin-containing solder to prevent fixed contacts.
Brand Panasonic Corporation
Product Series Narrow Pitch Connectors
Pitch Size 0.4 mm
Application Board-to-board, Board-to-FPC
ItemSpecificationsConditions
Rated current0.3 A/pin contact (Max. 5 A at total pin contacts)
Rated voltage60 VAC/DC
Dielectric strength150 V AC for 1 min.1 mA when the specified voltage is applied for one minute.
Insulation resistanceMin. 1,000 M (initial)Using 250 V DC megger (applied for 1 min.)
Contact resistanceMax. 90 mBased on the contact resistance measurement method specified by JIS C 5402.
Composite insertion forceMax. 0.981 N/pin contact x pin contacts (initial)
Composite removal forceMin. 0.0588 N/pin contact x pin contacts
Ambient temperature-55 to +85C*No icing. No condensation.
Soldering heat resistanceReflow soldering: Peak temperature: 260C or less
Soldering iron: 300C within 5 sec. / 350C within 3 sec.
The initial specification must be satisfied electrically (on the surface of the PC board around the connector terminals) and mechanically.
Storage temperature-55 to +85C (product only)
-40 to +50C (emboss packing)
No icing. No condensation.
Thermal shock resistance (mated)Min. 100 M (insulation resistance)
Max. 90 m (contact resistance)
Conformed to MIL-STD-202F, method 107G
Order | Temperature (C) | Time (minutes)
1 | -55 | 30
2 | 30 | 30
3 | +85 | 30
4 | -55 | 30
5 | +85 | 30
Humidity resistance (mated)Min. 100 M (insulation resistance)
Max. 90 m (contact resistance)
Conformed to IEC60068-2-78
Temperature 402C, humidity 90 to 95% RH
120 hours.
Saltwater spray resistance (mated)Min. 100 M (insulation resistance)
Max. 90 m (contact resistance)
Conformed to IEC60068-2-11
Temperature 352C, saltwater concentration 51%
HS resistance (mated)Max. 90 m (contact resistance)48 hours, Temperature 402C, gas concentration 31 ppm, humidity 75 to 80% RH
Lifetime50 timesInsertion and removal speed of Max. 200 times/hour
Unit weightSocket: 0.04 g
Header: 0.02 g
20 pins
Mated height1.5 mm
Part NameMaterialSurface Treatment
Molded portionLCP resin (UL94V-0)
Contact portionCopper alloyBase: Ni plating, Surface: Au plating
Terminal portionCopper alloyBase: Ni plating, Surface: Au plating (except the terminal tips)
Sockets: Soldering terminalsCopper alloyBase: Ni plating, Surface: Pd + Au flash plating (except the terminal tips)
Headers:Copper alloyBase: Ni plating, Surface: Au plating (except the terminal tips)
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