| Sign In | Join Free | My infospaceinc.com |
|
| Categories | Industrial Connectors |
|---|---|
| MOQ: | 200 |
| Model Number: | AXT340124 |
| Brand Name: | PANASONIC |
| Contact Plating: | Gold |
| Packaging Details: | SMD,P=0.4mm |
| Mounting Type: | Surface Mount,Vertical |
| Number of Pins: | 40P |
| Delivery Time: | 4-6 working days |
| Number of Rows: | 2 |
| Description: | nan |
| Stock: | 8522 |
| Pitch: | 0.4mm |
| Company Info. |
| Shenzhen ECER Network Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
These notes provide essential safety remarks and usage guidelines for narrow pitch connectors, including board-to-board and board-to-FPC applications. Adhering to these specifications is crucial to prevent circuitry damage, abnormal heating, smoke, fire, and to ensure the quality and reliability of Panasonic Corporation products.
| Item | Specifications | Conditions |
|---|---|---|
| Rated current | 0.3 A/pin contact (Max. 5 A at total pin contacts) | |
| Rated voltage | 60 VAC/DC | |
| Dielectric strength | 150 V AC for 1 min. | 1 mA when the specified voltage is applied for one minute. |
| Insulation resistance | Min. 1,000 M (initial) | Using 250 V DC megger (applied for 1 min.) |
| Contact resistance | Max. 90 m | Based on the contact resistance measurement method specified by JIS C 5402. |
| Composite insertion force | Max. 0.981 N/pin contact x pin contacts (initial) | |
| Composite removal force | Min. 0.0588 N/pin contact x pin contacts | |
| Ambient temperature | -55 to +85C* | No icing. No condensation. |
| Soldering heat resistance | Reflow soldering: Peak temperature: 260C or less Soldering iron: 300C within 5 sec. / 350C within 3 sec. | The initial specification must be satisfied electrically (on the surface of the PC board around the connector terminals) and mechanically. |
| Storage temperature | -55 to +85C (product only) -40 to +50C (emboss packing) | No icing. No condensation. |
| Thermal shock resistance (mated) | Min. 100 M (insulation resistance) Max. 90 m (contact resistance) | Conformed to MIL-STD-202F, method 107G Order | Temperature (C) | Time (minutes) 1 | -55 | 30 2 | 30 | 30 3 | +85 | 30 4 | -55 | 30 5 | +85 | 30 |
| Humidity resistance (mated) | Min. 100 M (insulation resistance) Max. 90 m (contact resistance) | Conformed to IEC60068-2-78 Temperature 402C, humidity 90 to 95% RH 120 hours. |
| Saltwater spray resistance (mated) | Min. 100 M (insulation resistance) Max. 90 m (contact resistance) | Conformed to IEC60068-2-11 Temperature 352C, saltwater concentration 51% |
| HS resistance (mated) | Max. 90 m (contact resistance) | 48 hours, Temperature 402C, gas concentration 31 ppm, humidity 75 to 80% RH |
| Lifetime | 50 times | Insertion and removal speed of Max. 200 times/hour |
| Unit weight | Socket: 0.04 g Header: 0.02 g | 20 pins |
| Mated height | 1.5 mm |
| Part Name | Material | Surface Treatment |
|---|---|---|
| Molded portion | LCP resin (UL94V-0) | |
| Contact portion | Copper alloy | Base: Ni plating, Surface: Au plating |
| Terminal portion | Copper alloy | Base: Ni plating, Surface: Au plating (except the terminal tips) |
| Sockets: Soldering terminals | Copper alloy | Base: Ni plating, Surface: Pd + Au flash plating (except the terminal tips) |
| Headers: | Copper alloy | Base: Ni plating, Surface: Au plating (except the terminal tips) |
|