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UMAX 91302-32-067RDM

Categories Industrial Connectors
Stock: 1185
Interface Form: M.2-M Key
Mounting Type: Surface Mount, Right Angle
MOQ: 1
Brand Name: 91302-32-067RDM
Delivery Time: 1 working day
Description: 67P Surface Mount, Right Angle SMD,P=0.5mm,Surface Mount,Right Angle Centronics Connectors RoHS
Packaging Details: SMD,P=0.5mm,Surface Mount,Right Angle
Model Number: 91302-32-067RDM
Number of Pins: 67P
Connector Type: Female
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UMAX 91302-32-067RDM

Product Overview

This specification covers the performance, tests, and quality requirements for the PCI Express M.2 connector. The product is designed to meet electrical, mechanical, and environmental performance requirements.

Brand UMaxconn
Model/Part Number PS-M2-01
Document Revision Rev 0
Date Issued 08-Nov-2016
SpecificationRequirementProcedure
Working Voltage (per pin)< 36 VAC-
Voltage (per pin)50 VAC-
Current (per pin)0.5 Amperes-
Operating Temperature-40C to 80C-
Low Level Contact Resistance (Initial)55 m max.EIA-364-23
Low Level Contact Resistance (Final)20 m max. change allowedEIA-364-23
Insulation Resistance500 M min.EIA-364-21
Dielectric Withstanding VoltageNo Breakdown (Current leakage: 1 mA max.)EIA-364-20 (300V AC min. at sea level for 1 minute)
Mating Force2.55 Kgf Max.EIA-364-13, Method A
ReseatingAppearance: No damageManually mated/unmated the connector or socket perform 3 cycles.
Durability (Au plating)60 mate/unmate cycles (15" & 30" Au plating)EIA-364-09
Durability (Gold flash plating)25 mate/unmate cyclesEIA-364-09
Durability (precondition)No evidence of physical damageEIA-364-09 (5 mate/unmate cycles)
Temperature Rise0.5A / power contact with 30 C MAX. change allowedEIA-364-70, Method 2
Vibration1.0 microsecond max.EIA-364-28, Condition VII, Condition letter D
Shock (Mechanical)1.0 microsecond max.250 G (Ultrabook) and 285 G (Tablet) at 2 milliseconds half sine on all six axis.
Cyclic Temperature & HumiditySee Product Qualification and Test Sequence Group 2EIA-364-31, Method III
Thermal ShockSee Product Qualification and Test Sequence Group 2EIA-364-32, method A test condition I
Temperature LifeSee Product Qualification and Test Sequence Group 1EIA-364-17, method A (105C for 120 hours)
Temperature Life (precondition)No physical damageEIA-364-17, method A (105C for 72 hours)
MFGNo physical damage and functional failedEIA-364-65 class IIA (7 days to simulate a 5 year field life)
Thermal DisturbanceSee Product Qualification and Test Sequence Group 810 cycles (153C to 853C)
Solderability (Tin plating)Min. of 95% solder coverageEIA-364-52 (2455C, for 4-5 sec.)
Solderability (Gold plating)Min. of 75% solder coverageEIA-364-52 (2455C, for 4-5 sec.)
Hand Soldering ResistanceAppearance: No damageT350C, 3 sec. at least.
Resistance to reflow soldering heatSee Product Qualification and Test Sequence Group 10 (Lead Free)Pre Heat: 150~180C, 60~120 sec. Heat: 230C Min., 40 sec. Min. Peak Temp.: 260C Max., 10 sec. Max. (2 reflow cycles)
Test or ExaminationGroup 1Group 2Group 3Group 4Group 5Group 6Group 7Group 8Group 9Group 10
Examination of product1, 6, 91, 6, 9, 121, 6, 91, 71, 41, 31, 71, 121, 31, 3
Low level contact resistance2, 5, 82, 5, 8, 112, 5, 82, 62, 4, 62, 5, 7, 9, 11----
Insulation resistance2---------
Dielectric withstanding voltage3---------
Mating / Unmating Force3, 5---------
Durability4---------
Durability (precondition)33333-----
Temperature Rise----------
Vibration----------
Shock (Mechanical)5---------
Reseating----------
Thermal Shock-4--------
Cyclic Temperature & Humidity-7--------
Temperature Life-4-4------
Temperature Life (precondition)-4-4------
MFG-----6----
Solderability--2-------
Thermal Disturbance------8---
Resistance to reflow soldering heat-----2----
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