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PANASONIC AXT550124

Categories Industrial Connectors
Description: nan
Stock: 6435
MOQ: 1
Model Number: AXT550124
Mounting Type: Surface Mount,Vertical
Pitch: 0.4mm
Brand Name: AXT550124
Number of Rows: 2
Packaging Details: SMD,P=0.4mm
Delivery Time: 1 working day
Number of Pins: 50P
Contact Plating: Gold
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PANASONIC AXT550124

Notes on Using Narrow Pitch Connectors / High Current Connectors

This document provides essential safety remarks and guidelines for using narrow pitch and high current connectors, focusing on preventing circuitry damage, ensuring safety, and optimizing product performance. It covers recommendations for board-to-board and board-to-FPC applications, including design considerations for PC boards and mounting equipment, as well as proper soldering and handling procedures.

Brand Panasonic Corporation
Product Series Narrow Pitch Connectors / High Current Connectors
Application Board-to-board / Board-to-FPC
Safety RemarksDescription
Usage LimitsDo not use connectors beyond specification sheets (rated current, dielectric strength, environmental conditions) to prevent abnormal heating, smoke, or fire. Thorough specification review is required. Contact Panasonic if usage is out of specifications; otherwise, quality and reliability are not guaranteed.
Quality & ReliabilityElectrical components have statistical failure probabilities and varying durability based on use environments. Check actual components under actual conditions before use. Continued use in degraded states can lead to insulation deterioration, abnormal heat, smoke, or fire. Implement safety designs (redundancy, fire spread prevention, malfunction prevention) to avoid injury, death, fire, or social damage.
PC Board Design ConsiderationsDetails
Multiple ConnectorsDo not connect a pair of boards with multiple connectors to avoid misaligned positions, mating failure, or product breakage.
Mounting Equipment ErrorAccount for potential positioning errors (0.2-0.3 mm) from mounting equipment when designing PC boards and patterns.
Positioning TabsIf connectors have embossed tabs for positioning, design PC boards with matching positioning holes.
Mechanical StrengthEnsure PC boards meet recommended pattern design dimensions for required mechanical strength when soldering connector terminals.
Coverlay/Adhesive ThicknessControl coverlay and adhesive thickness to prevent poor soldering, especially since this connector has no stand-off. Minimize thickness.
PC Board FixationFor narrow pitch series, design means to fix the PC board (e.g., with screws) to prevent it from coming off during vibrations or impacts and to protect soldered portions.
FPC Board MountingWhen soldering to FPC, use reinforcing plates (glass epoxy, polyimide 0.2-0.3mm, or SUS 0.1-0.2mm) larger than the PC board recommended process pattern to prevent solder detachment from terminal force during mating/unmating.
Temporary Locking StructureConsider measures to prevent mating separation due to dropping impact, size, weight, or bending force of the FPC, as this connector has a temporary locking structure.
Compact & Thin DesignTake care when mating narrow pitch connectors to avoid displacement or angled mating, which could damage or deform the connector.
Placement Machine & Mounting ProceduresDetails
Machine SelectionSelect placement machines considering connector height, required positioning accuracy, and packaging conditions.
Chucking ForceAvoid excessive chucking force from the placement machine, which can deform the connector body or terminals.
External ForcesBe aware that external forces during mounting can deform connector contact surfaces and terminals.
Self-AlignmentFor connectors where self-alignment may not be possible, carefully position the terminal with the PC board pattern.
Positioning BossesUse automatic positioning machines for accurate connector mounting, as positioning bosses provide only approximate alignment.
Static ElectricityIn dry conditions, take measures against static electricity (recommended humidity 40%-60%RH; use ionizer) to prevent products from adhering to carrier tape.
Soldering - Reflow SolderingDetails
Profile TemperatureMeasure recommended reflow profile temperature with a sensor near the connector surface or terminals on the PC board. Temperature settings vary by product.
Cream Solder PrintingScreen printing is recommended for cream solder.
Screen Opening & Foot PatternRefer to specifications for recommended PC board pattern and metal mask window size. Do not increase board pattern or metal mask size at the base of terminals.
Excess SolderAvoid too much solder, which can cause miss mating due to interference at the soldering portion.
Double-Sided MountingFor connectors mounted on the underside of a double-sided PC board, use adhesives or other means to secure the connector. Double reflow soldering on the same side is possible.
Solder/Flux CharacteristicsConsider solder and flux characteristics, and set reflow temperature and oxygen level accordingly, as conditions vary.
Resin-Containing SolderDo not use resin-containing solder, as it may firmly fix the contacts.
Temperature Profile ConditionsUse recommended reflow temperature profile conditions. Contact for profiles other than described (e.g., lead-free solder).
Metal Boards/TablesWhen reflow soldering on metal boards or tables for FPC mounting, ensure no connector deformation or discoloration occurs.
Screen Printing ThicknessConsult manufacturer when using a screen printing thickness other than recommended.
Soldering - Hand SolderingDetails
Soldering Iron TemperatureTip temperature: SMD type connectors 300C within 5 sec; other types 350C within 3 sec.
Flux SpreadPrevent flux from spreading onto connector leads or PC board to avoid flux rising inside the connector.
Solder ApplicationTouch iron to foot pattern, heat pattern and terminal, then apply solder wire to melt at the end of terminals. Apply solder wire at a small angle (up to 45 degrees).
Load During SolderingAvoid applying load on connector terminals during soldering to prevent improper operation.
Soldering Iron CleaningThoroughly clean the soldering iron.
Contact Surface CleaningAfter soldering, carefully check and clean off any solder from contact surfaces.
Excess Solder (Low Profile)For low profile types, avoid too much solder to prevent miss mating due to interference at the soldering portion.
Soldering - ReworkDetails
Rework OperationFinish reworking in one operation.
Bridge ReworkDo not use supplementary solder flux for rework of bridges, as it may cause contact problems.
Iron Tip TemperatureKeep soldering iron tip temperature below the specified limit (Table A).
Handling Single ComponentsDetails
DroppingDo not drop or allow parts to fall from workbenches.
Terminal ForceHandle with care; excessive force on terminals can cause warping, come-out, or weaken solder adhesion.
Insertion/Removal (Unsoldered)Do not insert or remove the connector when it is not soldered. External pressure can weaken terminal adherence or cause unevenness.
Precautions for MatingDetails
Mating MethodTake care not to mate connectors by press-fitting while inlets are not matched, strongly pressing and twisting, or tilted mating, to prevent deformation or damage to contacts and molding.
Cleaning Flux from PC BoardDetails
Cleaning RequirementNo need to clean this product. If cleaning, pay attention to prevent negative effects.
Cleaning SolventKeep cleaning solvent clean and prevent contact contamination. Pure water passed liquid solvent is recommended, as strong solvents may dissolve molded parts and characters.
Handling PC Board After MountingDetails
Cutting/BendingWhen cutting or bending the PC board after mounting, be careful not to subject soldered sections to excessive force.
Storage of ConnectorsDetails
HumidityAvoid storing in high humidity areas to prevent voids or air pockets from reflow soldering heat.
Color VariationColor may vary between connectors from different production lots. Slight color change from UV exposure is normal and does not affect operation.
StackingWhen storing assembled boards, be careful not to stack them in a way that subjects connectors to excessive forces.
DustAvoid storing in dusty locations, as dust accumulation can cause improper connections.
Other NotesDetails
Electrical StateDo not remove or insert electrified connectors (carrying current or applying voltage).
Dropping/MishandlingDropping or rough mishandling may bend or damage terminals, hindering proper reflow soldering.
Insertion/Removal Before SolderingTry not to insert or remove the connector more than necessary before soldering.
PC Board CoatingWhen coating the PC board, ensure the coating does not get on the connector to prevent insulation deterioration.
Production Lot Color VariationsVariations in product colors from different production lots are normal.
Switching UseConnectors are not designed for switching applications.
CondensationProduct failures due to condensation are not covered by warranty.
Sample OrdersDetails
Delivery ConditionSample connectors for confirming proper mounting are delivered in 50-piece units on an embossed tape. Reels are also available upon customer request.
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