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AX8300 Unicomp Bicycle brake component defect inspection

Categories Electronics X Ray Machine
Model Number: AX8300
MOQ: 1Set
Delivery Time: 15 days
Warranty: 1 year
Weight: 1350kg
Certification: CE, FDA
Packaging Details: Wooden Case, Waterproof, Anti-collision
Payment Terms: T/T,L/C
Dimension: 1215*1325*1700(mm)
Voltage: 110kv
Brand Name: UNICOMP
Place of Origin: China
Price: can negotiate
Power Supply: 220V,50Hz/60Hz 4A
Supply Ability: 30 sets per month
Product name: AX8300
Company Info.
Unicomp Technology
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AX8300 Unicomp Bicycle brake component defect inspection

The Unicomp AX8300 is a professional, purpose-built X-ray inspection system engineered for high-precision non-destructive testing in PCBA, SMT, and electronic component manufacturing. Featuring a proprietary 110kV micro-focus X-ray source, it perfectly fills the performance gap between conventional 90kV and 130kV X-ray devices — delivering balanced penetration power that solves the insufficient penetration of 90kV equipment and the excessive energy waste of 130kV models.

Integrated with a high-end flat-panel detector (FPD), the AX8300 captures ultra-high-definition, high-magnification images with industry-leading fineness. Supported by a full 360° rotating worktable, the system enables flexible multi-angle observation and comprehensive detection of hidden defects.

Key Features of the AX8300 X-ray Inspection System
  • 110kV microfocus X-ray source
  • High-resolution Flat Panel Detector (FPD)
  • X/Y/Z/Tilt motions (table, tube, FPD)
  • 360° table rotation
  • Angle view up to 70 degrees
  • Point-and-click location navigation
  • CNC programming for multiple image inspection routines
  • Maximum inspection area: 360 x 340mm
Applications and Defect Detection Capabilities
  • BGA / CSP / FLIP CHIP: Bridging, voids, opens, excessive or insufficient solder
  • QFN: Bridging, voids, opens, registration
  • SMT Standard Components: QFP, SOT, SOIC, chips, connectors, and others
  • Semiconductor: Bond wire, die attach void, mold, void
  • Multi-layer Board (MLB): Inner layer registration, PAD stack, blind and buried vias
Technical Specifications
ModelAX8300
Max kV / Type110 kV / Sealed
Power Consumption900W
Max. Electron Beam Power25W
Focal Spot Size5μm
Geometric Magnification48.8X
Imaging System (Option)Flat Panel Detector
Door OpenHand-operated door
Monitor27" HD 4K Display
Dimensions1215 x 1325 x 1700mm
Weight1350kg
Radiation Safety<1μSv/hr
ControlKeyboard / Mouse / Joystick
Automated InspectionStandard
Primary ApplicationsChip inspection / Electronic components / Auto parts, etc.

Note: Focal spot size is variable. Please consult Unicomp for specific requirements.

X-ray Safety Commitment

All X-ray machines manufactured by Unicomp Technology meet the FDA-CDRH Regulation CFR 21 1020.40 Subchapter J for cabinet X-ray systems. The FDA-CDRH standard for cabinet X-ray systems states that radiation emissions will not exceed 0.5 millirem/hr at 2" from any external surface. Our machines typically emit 15 times less radiation.

Dimensions and Appearance
Unicomp AX8300 X-ray inspection machine showing overall dimensions and external appearance
AX8300 X-ray inspection system — dimensions and external appearance
Inspection Images
AX8300 X-ray inspection sample image showing high-resolution PCB component analysis
High-resolution X-ray inspection image captured by the AX8300
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