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TE Connectivity 2013022-1

Categories Memory Connectors
Model Number: 2013022-1
Description: Gold Surface Mount,Vertical 204P SMD Inline Module Sockets RoHS
Mounting Type: Surface Mount,Vertical
Delivery Time: 4-6 working days
Stock: 4
Contact Plating: Gold
MOQ: 22
Packaging Details: SMD
Brand Name: TE Connectivity
Number of Pins: 204P
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TE Connectivity 2013022-1

Product Overview

Product Name: Double Data Rate (DDR) 3 SO DIMM Sockets

Description: Right Angle Module Orientation, 204 Position, .6 mm [.024 in] Centerline SO DIMM Sockets with a Stack Height of 4 mm [.157 in].

Usage Conditions:

  • Operating Temperature Range: -55 -85 C[-67 185 F]

Application: Memory Socket Type: Memory Card, DRAM Type: Double Data Rate (DDR) 3. Suitable for Printed Circuit Board termination.

Product ID

TE Internal #: 2013022-1

Product Type

SO DIMM Sockets

Brand

TE

Module Orientation

Right Angle

Housing Material

High Temperature Thermoplastic

Housing Color

Black

Latch Material

Stainless Steel

Ejector Type

Locking

Packaging Method

Semi-Hard Tray Assembly

Packaging Quantity

20

EU RoHS Compliance

Compliant

EU ELV Compliance

Compliant

China RoHS 2 Directive

No Restricted Materials Above Threshold

EU REACH Regulation

Does not contain REACH SVHC

Halogen Content

Low Halogen - Br, Cl, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free

Solder Process Capability

Reflow solder capable to 260C

UL Flammability Rating

UL 94V-0

Technical Specifications

Part NumberNumber of PositionsCenterline (Pitch)Stack HeightRow-to-Row SpacingContact Current Rating (Max)Contact Base MaterialPCB Contact Termination Area Plating MaterialContact Mating Area Plating MaterialModule Key TypeConnector SystemDRAM Type
2013022-1204.6 mm [.024 in]4 mm [.157 in]8.2 mm [.322 in]SACopper AlloyGold FlashGold FlashSGRAMCable-to-BoardDouble Data Rate (DDR) 3
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