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Amphenol 10124632-0030001LF

Amphenol 10124632-0030001LF

Amphenol 10124632-0030001LF
Amphenol 10124632-0030001LF
Categories Memory Connectors
Model Number: 10124632-0030001LF
MOQ: 15
Delivery Time: 9-11 working days
Description: Through Hole Inline Module Sockets RoHS
Stock: 562
Packaging Details: Through Hole
Brand Name: Amphenol
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Company Info.
Shenzhen ECER Network Technology Co., Ltd.
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Amphenol 10124632-0030001LF

Product Overview

FCI's Vertical DDR4 DIMM sockets offer 288 contacts on a 0.85mm pitch, designed to accommodate DDR4 memory modules conforming to JEDEC MO-309. These sockets are engineered for convenient memory expansion in servers, workstations, desktop PCs, and embedded applications within communications and industrial equipment. Featuring low-resistance contacts, they support Registered DIMMs (RDIMM) to reduce power consumption in datacenter hardware like servers, storage, and networking equipment. The low 2.4mm module seating plane and slim ejector designs optimize airflow. Available termination options include Surface-Mount (SMT), Plated-Through-Hole (PTH) solder, and Press-Fit (PF).

Product Attributes

  • Brand: FCI
  • Contact Material: Copper alloy
  • Contact Finish Options: 15in., 20in. or 30in. Gold, 30in. GXT, or Gold flash over nickel (Contact area); Tin over nickel (Termination area)
  • Forklock Material: Copper alloy
  • Housing Material: High temperature thermoplastic, UL94V-0
  • Ejector Material: High performance thermoplastic, UL94V-0
  • Certifications: UL and CSA approvals pending; RoHS-Compliant and lead-free process-compatible options available
  • Packaging: Tray

Technical Specifications

SpecificationDetails
Product TypeVertical DDR4 DIMM Sockets
Contact Pitch0.85mm
Number of Contacts288
Module StandardJEDEC MO-309
Module Seating Plane2.4mm
Insertion Force< 24 pounds force
Solder Tail Thickness Support1.6mm or 2.4mm motherboards
Press-fit Termination Support1.6mm min. host-PCBs
High-Speed SignalingUp to 3.2Gb/s for DDR4
Contact Resistance10m initial, 10m increase after environmental test
Current Rating0.75A/contact (De-rated) with 30 C temperature rise above ambient
Durability25 cycles
Product SpecificationGS-12-1092
Packaging SpecificationGS-14-2267
JEDEC Module OutlineMO-309
JEDEC Socket OutlinesPTH solder: SO-016, Surface-mount: SO-017, Press-fit: SO-019
Part Reference (SMT)10124677
Part Reference (PTH Solder)10124632
Part Reference (Press-fit)10124806
BWBDDR4MMS0613EA4Part Number
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Amphenol 10124632-0030001LF

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