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Amphenol 10124806-01006LF

Categories Memory Connectors
Packaging Details: Through Hole
Stock: 784000
Model Number: 10124806-01006LF
MOQ: 1568
Delivery Time: 10 weeks
Description: Through Hole Inline Module Sockets RoHS
Brand Name: Amphenol
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Amphenol 10124806-01006LF

Product Overview

FCI's Vertical DDR4 DIMM sockets offer a robust solution for memory expansion in demanding applications. Designed to JEDEC MO-309 standards, these 288-contact sockets feature a 0.85mm pitch and are ideal for servers, workstations, desktop PCs, and embedded systems in communications and industrial equipment. The low-resistance contacts support RDIMM modules, contributing to reduced power consumption in datacenter hardware. With a low 2.4mm module seating plane and slim ejector design, these sockets optimize airflow. Available in Surface-mount (SMT), Plated-Through-Hole (PTH) solder, and Press-fit (PF) termination options, they provide mechanical voltage keying and end latches for secure module retention and ejection. The low insertion-force design simplifies module installation, and contact protection supports high-speed serial differential signaling up to 3.2Gb/s.

Product Attributes

  • Brand: FCI
  • Contact Material: Copper alloy
  • Contact Finish (Contact Area): 15in., 20in., or 30in. Gold, 30in. GXT, or Gold flash over nickel
  • Contact Finish (Termination Area): Tin over nickel
  • Forklock Material: Copper alloy
  • Housing Material: High temperature thermoplastic, UL94V-0
  • Ejector Material: High performance thermoplastic, UL94V-0
  • Compliance: RoHS-Compliant and lead-free process-compatible options
  • Approvals: UL and CSA approvals pending
  • Packaging: Tray

Technical Specifications

SpecificationDetails
Product TypeVertical DDR4 DIMM Sockets
Number of Contacts288
Pitch0.85mm
JEDEC StandardMO-309
Module Seating Plane Height2.4mm
Insertion ForceLess than 24 pounds force
Solder Tail OptionsSupport for 1.6mm or 2.4mm thick motherboards
Press-fit TerminationSupports 1.6mm min. host-PCBs
High-Speed SignalingUp to 3.2Gb/s for DDR4
Contact Resistance10m initial, 10m increase after environmental test
Current Rating0.75A/contact (De-rated) with 30C temperature rise above ambient
Durability25 cycles
Product SpecificationGS-12-1092
Packaging SpecificationGS-14-2267
Socket Outlines (PTH Solder)SO-016
Socket Outlines (Surface-mount)SO-017
Socket Outlines (Press-fit)SO-019
Part Reference (SMT)10124677
Part Reference (PTH Solder)10124632
Part Reference (Press fit)10124806
Part Number ExampleBWBDDR4MMS0613EA4

Target Markets/Applications

Data, Servers, Storage Systems, Supercomputers, Workstations, Desktop PCs, Communications, Switches, Routers, Wireless Infrastructure, Industrial, Embedded Systems.

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