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TE Connectivity 5106773-1

Categories Backplane Connector
Stock: 40
Packaging Details: Through Hole,P=2mm
Model Number: 5106773-1
Brand Name: TE Connectivity
MOQ: 1
Delivery Time: 1 working day
Description: Through Hole,P=2mm Hard Metric, Standard RoHS
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TE Connectivity 5106773-1

Product Overview

The TE Connectivity 5106773-1 is a Hard Metric Backplane Connector, specifically a PCB Mount Receptacle designed for mezzanine applications. It supports data rates of up to 1 Gb/s and features a 22-column, 5-row configuration with 110 positions and a 2 mm [.078 in] centerline. This connector is part of the Z-PACK 2mm HM series, offering a robust solution for board-to-board connections in demanding environments.

Product Attributes

  • Brand: TE Connectivity
  • Series: Z-PACK 2mm HM
  • Product Type: Hard Metric Backplane Connector
  • Connector Type: PCB Mount Receptacle
  • Assembly Type: Mezzanine
  • Primary Product Color: Gray
  • Housing Material: Polyester - GF
  • UL Flammability Rating: UL 94V-0
  • EU RoHS Directive: 2011/65/EU Compliant
  • EU ELV Directive: 2000/53/EC Compliant
  • China RoHS Directive: MIIT Order No 32, 2016
  • REACH Regulation: Compliant (Does not contain REACH SVHC)
  • Halogen Content: Not Low Halogen - contains Br or Cl > 900 ppm.

Technical Specifications

Specifications

Part Number5106773-1
DescriptionHard Metric Backplane Connectors, PCB Mount Receptacle
Number of Positions110
Number of Rows5
Number of Columns22
Centerline (Pitch)2 mm [.078 in]
Data Rate≤1 Gb/s
PCB Connector Assembly TypePCB Mount Receptacle
Backplane ArchitectureMezzanine
Contact Base MaterialPhosphor Bronze
Contact Current Rating (Max)1.5 A
Operating Temperature Range-55 125 °C [-67 257 °F]
Housing MaterialPolyester - GF
Mating Alignment TypeMulti-Purpose
PCB Mount OrientationVertical
Feedthrough Post Length3.7 mm
Contact Mating Area Length3.3 mm
Contact Underplating MaterialNickel
PCB Contact Termination Area Plating MaterialTin
Contact Mating Area Plating MaterialNickel
Contact Mating Area Plating Material Thickness1.27 µm [50 µin]
Dimensions - Backplane Module Length50 mm
SealableNo
ShieldedNo
Packaging Quantity11
Packaging MethodTray
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