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TE Connectivity 1612618-1

Categories Memory Connectors
Packaging Details: SMD
Number of Pins: 200P
Mounting Type: Surface Mount, Right Angle
Stock: 600
Brand Name: TE Connectivity
Contact Plating: Gold
MOQ: 100
Delivery Time: 4-5 working days
Model Number: 1612618-1
Description: 200 Position Gold Surface Mount, Right Angle
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TE Connectivity 1612618-1

Product Overview

Function: DDR SODIMM, SO DIMM Sockets for Double Data Rate (DDR) memory modules.

Usage Conditions: Operating Temperature Range -55 to 85 C [-67 to 185 F].

Application: Power, Circuit applications.

Brand

TE

Product Type

DDR SODIMM, SO DIMM Sockets

DRAM Type

Double Data Rate (DDR)

Module Orientation

Right Angle

Stack Height

9.2 mm [.362 in]

Row-to-Row Spacing

6.2 mm [.244 in]

Centerline (Pitch)

0.6 mm [.024 in]

Number of Positions

200

Number of Rows

2

Number of Bays

2

Number of Keys

1

Housing Material

High Temperature Thermoplastic

Housing Color

Black

Contact Base Material

Copper Alloy

PCB Contact Termination Area Plating Material

Gold Flash

Contact Mating Area Plating Material

Gold Flash

Latch Material

Stainless Steel

Latch Plating Material

Tin

Ejector Type

Locking

Ejector Location

Both Ends

Connector Profile

Ultra High

SGRAM Voltage

25V

Contact Current Rating (Max)

SA

Packaging Quantity

20

Packaging Method

Semi-Hard Tray Assembly

Termination Method to PCB

Surface Mount

Connector Mounting Type

Board Mount

PCB Mount Retention Type

Solder Peg

Mating Alignment Type

Standard Keying

Insertion Style

Cam-In

UL Flammability Rating

UL 94v-0

Halogen Content

Low Halogen - Br, CI, F, I < 900 ppm per homogenous material. Also BFR/CFR/PVC Free

Solder Process Capability

Reflow solder capable to 245C

EU RoHS Compliance

Compliant

EU ELV Compliance

Compliant

China RoHS 2 Directive

MIIT Order No 32, 2016 No Restricted Materials Above Threshold

EU REACH Regulation

Current ECHA Candidate List: JUNE 2024 (241), Candidate List Declared Against: JUNE 2024 (241), Does not contain REACH SVHC

Part NumberDRAM TypeStack HeightModule OrientationNumber of PositionsCenterline (Pitch)SGRAM VoltagePackaging QuantityUL Flammability RatingTermination Method to PCBConnector Mounting TypeHousing MaterialContact Base MaterialPlating Material (Termination Area)Plating Material (Mating Area)Latch MaterialHalogen ContentSolder Process Capability
1612618-1Double Data Rate (DDR)9.2 mm [.362 in]Right Angle2000.6 mm [.024 in]25V20UL 94v-0Surface MountBoard MountHigh Temperature ThermoplasticCopper AlloyGold FlashGold FlashStainless SteelLow HalogenReflow solder capable to 245C
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