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Samtec EBTM-6-12-2.0-S-VT-1

Categories Board To Board Connectors
Model Number: EBTM-6-12-2.0-S-VT-1
Brand Name: Samtec
Packaging Details: -
Stock: 104
Description: Specialized Connectors RoHS
MOQ: 1
Delivery Time: 10-15 working days
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Samtec EBTM-6-12-2.0-S-VT-1

ExaMAX High-Speed Backplane System

The ExaMAX High-Speed Backplane System is designed for high-speed applications, meeting and exceeding industry specifications such as OIF CEI-28G-LR. It offers high performance with a staggered differential pair design, two reliable points of contact with a 2.4 mm wipe, and shielded wafer design to reduce crosstalk. Available in 24-72 pair designs with modular flexibility, it supports PCIe 6.0/CXL 3.1 and reduces costs through lower layer counts. The system is available in vertical and right-angle headers and uses press-fit tails for reliable electrical connections.

Product Attributes

  • Brand: Samtec
  • Certifications: PCI-SIG, PCI Express
  • Trademark: ExaMAX
  • Origin: Designed and built according to Samtec's specifications

Technical Specifications

SeriesInsulator MaterialContact MaterialPlatingOperating Temp RangeCurrent RatingVoltage RatingLead-Free SolderablePitchNo. of Pairs per ColumnColumnsOrientationGuidanceKeying
EBTM/EBTF/EBDMLiquid Crystal PolymerCopper AlloySn or Au over 50 " (1.27 m) Ni-55 C to +105 C4 A per pin150 VACYes(2.00 mm) .0787"-4, -6-06, -08, -10, -12VT (Vertical), RA (Right-Angle)L (Left), R (Right)A thru H
EPTT/EPTSHigh Temperature ThermoplasticCopper AlloySn or Au over 50 " (1.27 m) Ni-55 C to +105 C14.1 A per pin150 VACYes(2.00 mm) .0787"-4, -6-06, -08, -10, -12VT (Vertical), RA (Right-Angle)L (Left), R (Right)A thru H
EBCM/EBCFLiquid Crystal PolymerCopper AlloyAu over 50 " (1.27 m) Ni-40 C to +105 C3.6 A per pin125 VACN/A(2.00 mm) .0787"-4, -6-06, -08, -10, -12VT (Vertical), RA (Right-Angle)L (Left), R (Right)A thru H
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