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10 Layer Gold Immersion Rigid PCB Board Layout HASL 1OZ Squre For Industrial Control

Categories PCB Prototype Service
Brand Name: China chao sheng
Model Number: CSPCB1529
Certification: ISO/UL/RoHS/TS
Place of Origin: Shenzhen, Guangdong, China
MOQ: 1PCS
Price: usd3.28/pcs
Payment Terms: L/C, T/T, MoneyGram, Western Union
Supply Ability: 200000pcs / per per day
Delivery Time: 25-35day
Packaging Details: Anti-static bag + Anti-static bubble wrap + Good quality carton box
Product Areas: Communication Systems
Material: RF PCB – Radio Frequency Printed Circuit Boards
Product Structure: 10 Layers AnylayerHDI
Line Width And Space: 3/3mil
Minimum Hole: 0.10mm
Plate Thickness: 1.60mm
Surface Treatment: Immersion Gold, Electro-nickel Gold, Immersion Tin, OSP, Lead-free Spray Tin
Provide PCB Information: Gberber, Production Requirements, MOQ Quantity
E-Test: 100%
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10 Layer Gold Immersion Rigid PCB Board Layout HASL 1OZ Squre For Industrial Control

10 layer gold immersion rigid PCB board layout HASL 1 OZ Squre Board For industrial control

RF PCB – Radio Frequency Printed Circuit Boards

Call us or get an instant PCB quote. Tell our experts what you need and we will provide you with the right PCB fabrication and PCB assembly solution. We are ready and eager to turn your concepts into reality.

Printed circuit board (pcb) and PCBA products
Communication terminal, communication station, electronic communication, optical fiber, optical module, communication equipment, communication instrument, computer, household appliance, testing equipment, testing instrument, instrument, SD card, SG card, mobile phone, computer, various antennas, cars, music Equipment, playback equipment, banking equipment, medical instruments, medical equipment, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products,computers,etc.Applications;
Flexible circuit board (FPC) and FPCA product areas
CD, hard disk, printer, fax machine, scanner, sensor, mobile phone, connector, module, walkie-talkie antenna card, high-end camera, digital camera, laser head, CD, medical, instrumentation, drive, automotive instrumentation, medical instrument, Medical equipment, banking equipment, industrial instruments, LED light bars, military, aviation, aerospace, defense and other high-tech products, of which more than 70% of the products are exported to Europe, America, Europe, Central Europe, Western Europe, Southeast Asia, Asia-Pacific and other countries and area.

The main difference between RF circuit boards and Microwave PCBs is in the radio frequency in which they operate. Microwave PCBs are classified as any RF circuit board operating above 2GHz.

RF circuit boards and Microwave PCBs are used for communication signals in any application that requires receiving and transmitting radio signals. For example, some common applications are cell phones and radar installations.Microwave PCB and RF Circuits–Common Problems and Solutions

RF circuit boards, and Microwave PCBs, are especially difficult to design compared to traditional PCB layouts. This is due to the problems that could arise in receiving or transmitting the radio signals. Some of the main problems are noise sensitivity, and tighter impedance tolerances

Compared to traditional circuit boards, radio and microwave signals are very sensitive to noise and also require much tighter impedance tolerances. The best solution for these problems is to utilize ground plans and use a generous bend radius on impedance controlled traces. These solutions will ultimately allow the RF/Microwave PCB to achieve the best performance.

RF Board Applications

RF boards have a multitude of different applications, including wireless technologies, smart phones, sensors, robotics and security. With the advent of new technologies that are pushing the limits of electronics, the demand for RF boards is on the rise.

Finding a capable RF PCB manufacturer is critical to make sure the boards are fabricated to high quality standards and on-time. Our reputation speaks for itself. We pride ourselves on bringing the most demanding layout concepts to reality.

RF MATERIALS BY APPLICATION

We can help with everything from saving cost on a simple board to manufacturing advice for cutting edge, fifty layer designs. To simplify your search, here are several recommendations for materials based on application and manufacturability:

Important Note: Within every industry, there is a wide range of applications, demands, and budgets.

The table below provides general recommendations, but to find the best PCB materials for your specific project, please contact our engineering staff.

RF ApplicationRF MaterialsBonding MaterialsAttributes
Consumer Electronics

RO3006

RO3010

RO4835

RO3000 Series Bondply

2929 Bondply

Cost effective with dependable electrical and thermal characteristics
Military/Space

RT/Duroid

RO4000

RO4450B / RO4450FThe best in electrical and thermal performance and environmental durability
High Power Applications

6035HTC

XT/Duroid

Superior thermal management
MedicalRO4350B

RO4400 Bondply / 2929

Bondply

Versatile high performance properties to suit a range of device types
Automotive

RO3003

RO4000

RO4350B

RO4400 BondplyExcellent electrical performance compatible with standard manufacturing processeses
Industrial

RO4835

RO4350B

XT/Duroid

M6

M7

3M

2929 Bondply

RO4400 Bondply

Excellent durability and environmental resistances, including oxidation

FAQ:

Q: What files do you use in PCB fabrication?

A: Gerber or Eagle, BOM listing, X, Y sitting report, PNP and Components Position

Q: Is it possible you could offer sample?

A: Yes, we can custom you sample to test before mass production

Q: When will I get the quotation after sent Gerber, BOM and test procedure?

A: Within 6-48hours for PCB quotation and around 24-48 hours for PCBA quotation.

Q: According to the difficulty of high-layer boards, How can I know the process of my PCB production?

A: 7-35days for PCB production and components purchasing, and 14-20days for PCB assembly and Testing

Q: How can I make sure the quality of my PCB?

A: We ensure that each piece of PCB, PCBA products work well before shipping. We'll test all of them according to your test procedure.

PCB, FPC process production capability

Technical ltemMassProductAdvanced Technology
201620172018
Max.Layer Count26L36L80L
Through-hole plate2~45L2~60L2~80L
Max.PCBSize(in)24*52"25*62"25*78.75"
The layer number of FPC1~36L1~50L1~60L
Max.PCBSize(in)9.8"*196"9.8"*196"10"*196"Reel to reel
Layeredplatelayer2~12L2~18L2~26L
Max.PCBSize(in)9"*48"9"*52"9"*62"
Combination of hard and soft layers3~26L3~30L3~50L
Interconnect HDI5+X+5Interconnect HDI7+X+7Interconnect HDI8+X+8,Interconnect HDI
HDI PCB4~45L4~60L4~80L
Interconnect HDI3+20+34+X+4Interconnect HDI4+X+4,Interconnect HDI
Max.PCBSize(in)24"*43"24"*49"25"*52"
MaterialFR-4 RogersFR-4 RogersFR-4 Rogers
Base materialHalogenfree,LowDKHalogenfree,LowDKHalogenfree,LowDK
Build-up MaterialFR-4FR-4FR-4
BOard,Thickness(mm)Min.12L(mm)0.430.42~8.0mm0.38~10.0mm
Min.16L(mm)0.531.60~8.0mm0.45~10.0mm
Min.18L(mm)0.632.0~8.00.51~10.0mm
Min.52L(mm)0.82.50~8.0mm0.65~10.0mm
MAX(mm)3.510.0mm10.0mm
Min.CoreThickness um(mil)254"(10.0)254"(10.0)0.10~254(10.0mm)
Min.Build up Dielectric38(1.5)32(1.3)25(1.0)
BaseCopperWeightInner Layer4/1-8 OZ4/1-15 OZ4/1-0.30mm
Out Layer4/1-10 OZ4/1-15 OZ4/1-30 OZ
Gold thick1~40u"1~60u"1~120u"
Nithick76~127u"76~200u"1~250u"
Min.HOle/Land um(mil)150/300(6/12)100/200(4/8)100/200(4/8)
Min.Laser via/landum(mil)60/170(2.4/6.8)50/150(2/6)50/150(2/6)
Min. IVH,Hole size/landum(mil)150/300(6/12)100/200(4/8)100/200(4/8)
DieletricThickness38(1.5)32(1.3)32(1.3)
125(5)125(5)125(5)
SKipviaYesYesYes
viaoNhie(laserviaon BuriedPTH)YesYesYes
Laser Hole FillingYesYesYes
TechnicalltemMass ProductAdvanced Technolgy
2017year2018year2019year
Drill hole depth ratioThroughHole2017year.40:1.40:1
Aspet RatioMicro Via.35:11.2:11.2:1
Copper Filling Dimple Size um(Mil)10(0.4)10(0.4)10(0.4)
Min.LineWidth&spacelnner Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
Plated Layer um(mil)45/45(1.8/1.8)38/38(1.5/1.5)38/38(1.5/1.5)
BGAPitch mm(Mil)0.30.30.3
Min.PTH Hole ring um(mil)75(3mil)62.5(2.5mil)62.5(2.5mil)
Line Width Control∠2.5MIL±0.50±0.50±0.50
2.5Mil≤L/W∠4mil±0.50±0.50±0.50
≦3mil±0.60±0.60±0.60
Laminated structureLayer by layer3+N+34+N+45+N+5
Sequential Build-up20L Any Layer36L Any Layer52L Any Layer
Multi-layer overlayN+NN+NN+N
N+X+NN+X+NN+X+N
sequential Lamination2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
Soft and hard bonding2+(N+X+N)+22+(N+X+N)+22+(N+X+N)+2
PTH filling processPTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole
PTH resin plug hole + plating fill
Electroplated hole/copper plug hole

6 layers AnylayerHDI, Halogen-free FR-4 TG150 Thick copper + thick gold inner and outer copper, HDI Printed Circuit Boar

6 layers AnylayerHDI, Halogen-free FR-4 TG150 Thick copper + thick gold inner and outer copper, HDI Printed Circuit Boar

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