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| Categories | Hermetically Sealed Electronic Packages |
|---|---|
| Brand Name: | JOPTEC |
| Place of Origin: | HEFEI, CHINA |
| MOQ: | 50 PCS |
| Payment Terms: | T/T |
| Supply Ability: | 5000000 PCS/Month |
| Delivery Time: | 30 Days |
| Packaging Details: | Boxes |
| bottom: | CS1010 |
| lead1: | oxgyen free copper |
| lead: | copper cored alloy |
| insulator: | Al2O3 |
| Hermeticity: | Leak rate <=1*10-3 Pa*cm3/s. |
| Insulation resistance: | 500V DC |
| Housing material: | CRS1010 |
| Company Info. |
| JOPTEC LASER CO., LTD |
| View Contact Details |
| Product List |
| Product name: | Customized Ceramic To Metal Sealing Package With Lead Pitch And Ceramic Terminals | |
| Product formation | Material | Quantity |
| bottom | CS1010 | 1 |
| lead1 | oxgyen free copper | 4 |
| lead 2 | copper cored alloy | 8 |
| insulator | Al2O3 | 12 |
| Plating coating: | Coating: shell and lead plating Ni:3-11.43um, lead plating Au>=1.3um. | |
| Hermeticity: | Leak rate <=1*10-3 Pa*cm3/s. | |
| Insulation resistance: | 500V DC, Insulation resistance between a single glass closure lead and the shell≥1*1010Ω | |
| Product features: | 1. Housing material adopts CRS1010 which has good heat dissipation. | |
| 2. The pin material adopts Cupper cored alloy which has low resistance that can load high voltage. | ||
| 3. The method of sealing cap is parallel sealing welding. | ||
| 4. The pin cross bottom or sidewall which can be designed according to customers' needs. | ||
| 5. The position of ground lead can be designed according to customers' needs. | ||
| 6. The design of lid fits the dimension of package. | ||
| 7. Customers could choose fully plating or selective plating. | ||
| 8. All index of parameter conform to requirement of GJB548 | ||
|
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