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High Frequency ENIG 1.6mm 6 Layer 94v0 FR4 PCB Board

Categories FR4 Printed Circuit Board
Brand Name: HNL-PCBA
Model Number: PCB Assembly 08
Certification: ISO9001,IS16949, ISO14001,ROHS , UL, IPC-A , UL, QC080000
Place of Origin: CHINA
MOQ: 1 PC
Price: Negotiable
Payment Terms: T/T, Western Union, L/C, MoneyGram
Supply Ability: 10,000,000 Point /Day
Delivery Time: 1-7days
Packaging Details: ESD packaging with carton box
Product name: FR4 Printed Circuit Board
Material: FR4, 94v0 Circuit Board
Copper thickness: 0.3OZ, to 6OZ
Min. line spacing: 0.030mm
Min. hole size: Laser 0.05mm ; Mechnical 0.15mm
Service: One-stop Service,PCB&PCBA,ODM and OEM
PCB Assembly method: Mixed, SMT, and THT
Usage: OEM Electronics,Circuit Board Assembly
Board thickness: 0.3mm-3.5mm
solder mask: Green. Black. Red. Yellow. White. Blue etc.
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High Frequency ENIG 1.6mm 6 Layer 94v0 FR4 PCB Board

High Frequency ENIG 1.6mm 6-Layer 94v0 FR4 Printed Circuit Board


FR4 Printed Circuit Board Introduction


Generally using the single-sided PCB in simple electronic devices, which has a layer of conductive material.

Usually use the double-layer PCB in more complex circuits and equipment, and it has a layer of conductive material on both sides.

With the current technological develops fastly, single sided printed circuit boards cannot provide enough space and power.

So, double-sided circuit boards gradually are used more and more in some electronic devices replacing of the single-sided PCB.

The double sided PCB’s surface has copper plating, tin coating, it can withstand high temperatures better than single-sided printed circuit boards.

All of the other electronic components are mounted on the printed circuit boards(PCBs),which are the foundation.

PCBs have mechanical and electrical attributes,making them for ideal applications. Most PCB’s fabricated are rigid, roughly 90% of the PCB’s manufactured today are rigid boards.


PCB CAPABILITIES

FACTORY CAPABILITIES
No.Items20192020
1HDI CapabilitiesHDI ELIC (4+2+4)HDI ELIC(5+2+5)
2Max layer count32L36L
3Board ThicknessCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mmCore thickness 0.05mm-1.5mm ,Fineshed board thickness 0.3-3.5mm
4Min.Hole SizeLaser 0.075mmLaser 0.05mm
Mechnical 0.15mmMechnical 0.15mm
5Min Line Width/Space0.035mm/0.035mm0.030mm/0.030mm
6Copper Thickness1/3oz-4oz1/3oz-6oz
7Size Max Panel size700x610mm700x610mm
8Registration Accuracy+/-0.05mm+/-0.05mm
9Routing Accuracy+/-0.075mm+/-0.05mm
10Min.BGA PAD0.15mm0.125mm
11Max Aspect Ratio10:110:1
12Bow and Twist0.50%0.50%
13Impedance Control Tolerance+/-8%+/-5%
14Daily Output3,000m2 (Max capacity of equipment)4,000m2 (Max capacity of equipment)
15Surface FinishingENEPING /ENIG /HASL /FINGER GOLD/IMMERSION TIN/SELECTIVE THICK GOLD
16Raw MaterialFR-4/Normal Tg/High Tg/Low Dk/HF FR4/PTEE/PI

PCB Assembly Process



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Delivery Time


Product TypeQtyNormal lead timeQuick-turn lead time
SMT+DIP1-501WD-2WD8H
SMT+DIP51-2002WD-3WD1.5WD
SMT+DIP201-20003WD-4WD2WD
SMT+DIP≥20014WD-5WD3WD
PCBA(2-4Layer)1-502.5WD-3.5WD1WD
PCBA(2-4Layer)51-20005WD-6WD2.5WD
PCBA(2-4Layer)≥2001≥7WD5WD
PCBA(6-10Layer)1-503WD-4WD2.5WD
PCBA(6-10Layer)51-20007WD-8WD6WD
PCBA(10-HDILayer)1-507WD-9WD5WD
PCBA(10-HDILayer)51-20009WD-11WD7WD

FR4 Printed Circuit Board Application Field


Our products are widely used in communication equipment, industrial control, consumer electronics, medical equipment, aerospace, light-emitting diode lighting, automotive electronics etc.



Workshop



Common packaging


1.PCB: Vacuum packaging with carton box
2.PCBA: ESD packaging with carton box



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