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| Categories | AOI Tester |
|---|---|
| Brand Name: | MENTO |
| Model Number: | M2065 |
| Certification: | FCC.ROHS,CCC |
| Place of Origin: | DONGGUAN |
| MOQ: | 3 |
| Delivery Time: | 20 work days |
| Packaging Details: | 1200mm*1500mm*1800mm |
| Inspection Speed: | Up to 1500mm/s |
| Field Of View: | 20mm x 20mm |
| Application: | PCB Inspection |
| Resolution: | 5μm |
| Product Type: | Automated Optical Inspection System |
| Interface: | USB/Ethernet |
| Inspection Method: | Visual Inspection |
| Power Supply: | AC 220V/50Hz |
| Lighting: | LED |
| Operating System: | Windows |
| Software: | AOI Software |
| Dimensions: | 600mm x 600mm x 700mm |
| Camera: | High-resolution CCD |
| Warranty: | 1 year |
| Weight: | 50kg |
M20 Series Mini LED appearance inspection
| Model | M2065 | ||||
| Inspection | Inspection items | Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity | |||
| Inspection method | Image processing, machine learning | ||||
| Optical System | Camera | 65MP | 25MP | 20MP | 12MP |
| Lens | High resolution bi-telecentric lens | ||||
| Resolution | 4μm(2.4μm~10μm optional)RGB(Customisable) | ||||
| Light Source | RGB customizable | ||||
| Efficiency | Stop then go:3FOV/s | Flying shoot:10FOV/s | |||
| Computer Configuration | PC | CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6GB SSD:250G, HDD:2T | |||
| Monitor | 22 "LED | ||||
| Operating System | Ubuntu | ||||
| Inspection Performance | PCB Thickness | 1~5mm | |||
| Maximum allowable component height | Upper 20mm, Lower 30mm(Customizable) | ||||
| Driver | Servo motor+Screw guide | ||||
| Movement speed | Max:600mm/s | ||||
| PCB fixture height | 900+20mm(from floor to fixture surface) | ||||
| Parameters | PCB size | Max:600mmx500mm(single track, track width adjustable) | |||
| Power | AC220W50Hz2000W | ||||
| Dimensions | W1350xD1000xH1650mm(without alarm light) | ||||
| Weight | ≈1100KG | ||||
| Air Pressure Requirement | ≥0.5Mpa | ||||
| Environmental requirements | Temperature:5~40℃, RH 25%~80%(no frost) | ||||
| Upstream and downstream equipment communication | Standard SMEMA interface / data communication with die bonder | ||||
Pad measurement/Pad inspection /Solder paste printer/SPI/Die bonder/Pre-reflow AOI/
Reflow oven/Post-reflow AOI /Luminescence inspection/Colloid inspection/Laser Marker/Rework
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