Excellent Insulation Performance 1.5W/M-K Two Component Epoxy
Sealant For Electronic Component Encapsulation Protection
Company Profile
Ziitek company is a manufacturer of thermal conductive gap fillers,
low melting point thermal interface materials, thermal conductive
insulators, thermally conductive tapes, electrically & thermally
conductive Interface pads and thermal grease,Thermal Conductive
plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials
products, with well-equipped testing equipment and strong technical
force.
TIE®280-15AB is a two-component epoxy resin sealantwithgood thermal
conductivity and room temperature curing properties. It can
complete the curing process at room temperature and is convenient
for on-site operation and construction. And this material has
excellent fire and flame retardant properties, which can meet the
high safety requirements of electronic devices.It is particularly
suitable for the sealing protection of capacitors,small electronic
components,and precision circuit modules,and can provide long-term
reliable mechanical support and environmental protectionfor
sensitive components.
Feature
>Good thermal conductivity
>Excellent insulation performance
>Two-part formulation for easy storage
>Excellent low and high temperature mechanical and chemical
stability
>Ambient or accelerated cure schedules
Applications
>Electronic component encapsulation protection
>Power Supply and Electrical Control
>LED Lighting and Display
>New Energy and Automotive Electronics
>Communication and network equipment
| Typical Properties of TIE®280-15AB Series |
| Uncured Material Properties |
| Property | Value | Test Method |
| Construction | Epoxy resin | - |
| Color/Part A | Black | Visual |
| Color/Part B | White | Visual |
| Part A Viscosity (mPa·S) | 20,000 | ASTM D2196 |
| Part B Viscosity (mPa·S) | 20,000 | ASTM D2196 |
| Mix Ratio | 1:1 | - |
| Shelf life (Month) | 12(Unopened) | - |
| Cure Schedule |
| Pot Life @ 25°C | 4.5 hours | Ziitek Test Method |
| Cure @ 25°℃ | 4.5 hours | Ziitek Test Method |
| Cure @ 70°C | 20 min | Ziitek Test Method |
| Cure @ 100℃ | 15 mins | Ziitek Test Method |
| Cure Material Properties |
| Color | Gray | Visual |
| Density(g/cm³) | 1.5 | ASTM D792 |
| Hardness (Shore 00) | 75 | ASTM D2240 |
| Breakdown Voltage (V/mm) | ≥10,000 | ASTM D149 |
| Dielectric Constant @1MHz | 4.0 | ASTM D150 |
| Volume Resistivity (Ohm·cm) | >1.0x1015 | ASTM D257 |
| Thermal Conductivity (W/m·K) | 1.5 | ASTM D5470 |
| Recommended Operating Temperature (℃) | -40~160 | - |
| Flame Rating | V-0 | UL 94 |
Instruction For Use
1. Mixing
Resin is prone to sedimentation and stratification during
transportation or storage; therefore, it must be thoroughly stirred
before use.Weigh the resin (Part A) and curing agent (Part B)
accurately according to the recommended mixing ratio, then pour
them into a clean container for blending. The weighing equipment
shall meet the accuracy requirements to ensure the ratio is precise
and error- free. lf the ambient temperature is below 18℃, it is
recommended to preheat Part A in an oven at 50℃ for 45 minutes to
improve the fluidity of the mixed adhesive.
Caution: The preheating temperature during mixing is strictly
prohibited to exceed 50℃, as high temperatures will drastically
shorten the working life of the adhesive.First, stir manually for
2-3 minutes. During the stiring process, continuously scrape the
bottom and inner walls of the container to ensure the adhesive is
mixed uniformly. If conditions permit, perform additional
mechanical stiring for another 2~3 minutes. High-speed operation
shall be avoided during stirring to prevent air bubble generation
or further shortening of the adhesive's working life caused by
frictional heating.
2. Vacuumizing
To completely remove the air bubbles mixed into the adhesive during
stirring, it is necessary to perform vacuum degassing treatment on
the blended adhesive.Set the vacuum degree to.1-5 mmHg. During the
vacuumizing process, air bubbles inside the adhesive will
continuously precipitate and float to the surface. Maintain the
vacuum until the bubbles are basically eliminated; the degassing
time is generally 3-10 minutes.
3. Application
Inject the blended and degassed adhesive into the target mold.
Moderate preheating of the mold can reduce the adhesive viscosity
and improve its fluidity, ensuring the adhesive fully encapsulates
all areas of the coils or assemblies to be potted.For application
scenarios with high requirements for encapsulation compactness and
reliability,it is necessary to conduct a second vacuum treatment
after glue injection to completely eliminate residual bubbles
inside the adhesive and at the contact surfaces between the
adhesive and the assemblies.The curing process can be performed in
accordance with the recommended curing procedure specified in the
product documentation. To further enhance the adhesive's bonding
strength, compactness and weather resistance, it is recommended to
carry out an additional post-curing process with heating after the
completion of initial curing. Post-curing can generally be
conducted at the maximum curing temperature specified in the
product specification sheet, with constant-temperature baking for
2~4 hours; alternatively, the curing process parameters can be
adjusted according to actual application requirements.
Application Considerations
Please read the safety and health-related technical documents
carefully prior to use, and strictly comply with all requirements
specified in the product labels and safety data sheets.To ensure
the long-term stable performance and reliability of the electronic
encapsulated assemblies, it is necessary to perform thorough
cleaning of the component surfaces to remove attached contaminants
such as dust, moisture, salts and grease before each potting
operation.Such impurities are prone to causing quality defects
including short circuits, insufficient bonding strength and
substrate corrosion after encapsulation, which will seriously
impair the service life of the products.
Storage Guidelines
The resin and curing agent shall be stored in original sealed
containers and placed in a cool and dry area, which can effectively
extend the product shelf life. Storage methods and ambient
temperature are key factors affecting the product shelf life, and
must be strictly followed as required
Compatibility
Certain chemicals, such as plasticizers in the curing agent, may
inhibit the curing of this product. This issue can be resolved by
cleaning the substrate surface with a solvent or performing slight
baking at a temperature slightly higher than the curing
temperature. Special attention should be paid to the following
materials:Organic substances containing elements such as N, P and
S, and ionic compounds containing metal ions such as Sn, Pb, Hg, Bi
and As. Alkyne and polyvinyl-containing compoundsCondensation-type
adhesives, as well as molds and tools contaminated by such
adhesive.
Safety/Hygiene
Similar to other resin-based products, this product is irritating
to human skin and eyes. Some individuals may experience allergic
reactions characterized by skin rashes and itching after skin
contact with this product or inhalation of its volatile vapors. In
high- temperature operating environments, it may also trigger
respiratory odor hypersensitivity.
Special Warning: Component B (curing agent) is corrosive. Direct contact with skin
or eyes can cause chemical burns. Some divagctvva symptoms
including rashes, itching and dificulty breathing.A comprehensive
set of hygiene and safety protection measures must be established
during the handling of this product.
Operators shall wear safety goggles and chemical protective
clothing to avoid direct contact with the product. For details on
engineering control schemes, selection of personal protective
equipment and emergency response measures after accidental contact,
please refer to the Product Safety Data Sheet (SDS).
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality
control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract.
