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wuhan huagong laser engineering co.,ltd
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wuhan huagong laser engineering co.,ltd

wuhan huagong laser engineering co.,ltd

wuhan huagong laser engineering co.,ltd

With the features as high cutting speed, high efficiency, free-maintenance and high yield rate, HG Laser’s semiconductor wafer laser scribing machine has been enjoying the reputation and big market share since 2007 when it entered into market first time. After the long-time test of machine quality and process at customer’s site, HG Laser’s semiconductor wafer laser scribing machine proves to be superior to the blade cutting process and be taken as a high-tech product to meet the needs of modern technology.
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