With the features as high cutting speed, high efficiency,
free-maintenance and high yield rate, HG Laser’s semiconductor
wafer laser scribing machine has been enjoying the reputation and
big market share since 2007 when it entered into market first time.
After the long-time test of machine quality and process at
customer’s site, HG Laser’s semiconductor wafer laser scribing
machine proves to be superior to the blade cutting process and be
taken as a high-tech product to meet the needs of modern