Sign In | Join Free | My infospaceinc.com
infospaceinc.com
Products
Search by Category
Home > PCB & PCBA >

10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board

Categories HDI PCB Board
Brand Name: WITGAIN PCB
Model Number: S06E4691A0
Certification: UL Certificate
Place of Origin: China
MOQ: negotiable
Price: negotiable
Payment Terms: T/T
Supply Ability: 1kkpcs/month
Delivery Time: 20 work days
Packaging Details: 20pcs/bag, 20bags/carton
Material: FR4 , EM-370
Board Thickness: 1.6MM
Layer Count: 6 Layer
Solder Mask: Green
Surface Treatment: ENIG
Silkscreen: White
  • Haven't found right suppliers
  • Our buyer assistants can help you find the most suitable, 100% reliable suppliers from China.
  • And this service is free of charge.
  • we have buyer assistants who speak English, French, Spanish......and we are ready to help you anytime!
  • Submit Buying Request
    • Product Details
    • Company Profile

    10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board


    6 Layer Printed Circuit Board With Blind And Buried Holes


    PCB Specifications:


    Layer Count: 6Layer HDI PCB

    Board Thickness: 1.6MM

    Material: FR4 EM-370 EM-370(D) Datasheet 20171121_18061416999.pdf

    Holes: L1-L2 0.1MM, L2-L5 0.2MM, L5-L6 0.1MM, L1-L6 0.2MM

    Min Line: 3/5 Mil

    BGA Size: 10Mil

    Unit Size: 160MM*150MM/1UP

    Blind Holes: L1-L2 , L5-L6 0.1MM

    Buried Holes: L2-L5 0.2MM

    Solder Mask: Green

    Surface Treatment: ENIG

    Application: Industrial Control


    Our Manufacturing Capabilities:


    NOItemCapability
    1Layer Count1-24 Layers
    2Board Thickness0.1mm-6.0mm
    3Finished Board Max Size700mm*800mm
    4Finished Board Thickness Tolerance+/-10% +/-0.1(<1.0mm)
    5Warp<0.7%
    6Major CCL BrandKB/NanYa/ITEQ/ShengYi/Rogers Etc
    7Material TypeFR4,CEM-1,CEM-3,Aluminum,Copper, Ceramic, PI, PET
    8Drill Hole Diameter0.1mm-6.5mm
    9Out Layer Copper Thickness1/2OZ-8OZ
    10Inner Layer Copper Thickness1/3OZ-6OZ
    11Aspect Ratio10:1
    12PTH Hole Tolerance+/-3mil
    13NPTH Hole Tolerance+/-1mil
    14Copper Thickness of PTH Wall>10mil(25um)
    15Line Width And Space2/2mil
    16Min Solder Mask Bridge2.5mil
    17Solder Mask Alignment Tolerance+/-2mil
    18Dimension Tolerance+/-4mil
    19Max Gold Thickness200u'(0.2mil)
    20Thermal Shock288℃, 10s, 3 times
    21Impedance Control+/-10%
    22Test CapabilityPAD Size min 0.1mm
    23Min BGA7mil
    24Surface TreatmentOSP, ENIG,HASL, Plating Gold, Carbon Oil,Peelable Mask etc



    FAQ:


    Question: What is PCB High voltage testing or High Potential (HiPot) Testing? Why is it done?

    Answer: The High Potential (HiPot) test is conducted to check whether the dielectric material of a PCB board can withstand a voltage higher than its rated voltage without breaking down. This is a type of stress test helps measure the dielectric strength of the PCB substrate which in turn helps to measure the insulation capability of the Device Under Test (DUT). It also gives an idea to how much voltage the DUT can withstand during real-life applications.


    In this test, a high voltage is supplied to the PCB board for a few seconds to check for the insulation or dielectric strength of the components mounted on the PCB board. The duration of the HoPot test can vary from a few seconds to up to a few minuets. The IEC 60950 standard says the test must be conducted for 1 minute. A board is subjected to the HiPot test only after conducting fault detection, humidity, and vibration tests.

    Both AC and DC can be used to carry out HiPot Test. This can depend on the requirements established by the regulatory testing agency. However it is best to test an AC Powered device with a high AC Voltage and a DC powered device with a high DC voltage.


    How to calculate HiPot test voltage?


    There is no exact way to calculate the HiPot voltage, however a general rule of thumb would be (2 x Nominal input voltage) + 1000 V. For an instance, if the operating input voltage is 140 Volts then the HiPot Voltage would be (140 x 2) V + 1000 V = 1280 V or 1.28 KV.


    How is a HiPot Test performed?

    This test can be performed by applying a high voltage to the Printed Circuit Board or Device in which the PCB is used and monitoring the resulting leakage current. The voltage that is applied in a HiPot Test can be up to 10 times higher than the rated voltage of the PCB. The voltage is applied between the main input and the chassis (outer framework) of the product.

    In the above figure, we have considered a basic circuit to demonstrate the condition of HiPot test


    HiPot Test Pass Condition:


    If the substrate of the PCB can resist the high voltage without breaking down and also inhibits the flow of leakage current then it can be seen as a HiPot pass condition.

    Good insulation will not allow the flow of excess leakage current on the surface of the device.


    HiPot Test Fail Condition:


    If the breakdown occurs and there is no control on the leakage current then it can be considered as a HiPot fail condition.

    Poor insulation can cause the flow of excess leakage current on the surface of the device under test.

    Buy 10Mil BGA 1.6MM Immersion Gold 6 Layer HDI PCB Board at wholesale prices
    Send your message to this supplier
     
    *From:
    *To: Witgain Technology Ltd
    *Subject:
    *Message:
    Characters Remaining: (0/3000)
     
    Inquiry Cart 0