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2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

Categories Thermal Conductive Glue
Brand Name: Ziitek
Model Number: TIE™ 280-25AB
Certification: RoHs
Place of Origin: China
MOQ: 2kg/LOT
Supply Ability: 1000KG
Delivery Time: 2-3 work day
Packaging Details: 1kg/can
Hardness @25℃: 85 Shore D
Service temperature: -40℃ to +130℃
Glass transition temperature Tg: 92℃
Elongation: 0.10%
Thermal Conductivity: 2.5 W/m-K
Dielectric Strength: 300 volts / mil
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    2.5W / mK Low Viscosity adhesive Thermal Conductive Glue with -40℃ - 130℃ Service Temperature 85 Shore D

    2.5W / mK Low Viscosity Thermal Conductive Glue with -40℃ - 130℃ Service Temperature


    TIE™ 280-25AB is a two compound, high thermal conductive, low temperature cured, long pot life, fire resistant epoxy encapsulant compound. It is design for potting of capacitors and electrical devices.


    TIE280-25 A&B.pdf


    Features

    > Good thermal conductive: 2.5W/mK

    > Excellent insulation and smoothly sourface.

    > Low shrinkage

    > Low viscosity, expediting air releaseed.

    > Excellent in solvents and water proof.

    > Longer life time.

    > Excellent thermal shock efficiecy and impact resistance


    Application


    > Automotive starters potting; General potting Thermal detector potting

    > Ferrite adhesion; TIP type LED; Good adhesion to aromatic polyester

    > Relay sealant; Good adhesion to rubber, ceramics PCB and plastics

    > Power transformers and coils; Potting capacitors Potting of small electrical devices

    > Adhesion to metal glass and plastic LCD & substrates adhesion; Coating and sealant; Coil ; IGBTS; Transformer; Fire retardant

    > Optical / medical component adhesive


    Typical Uncured Material TIE™ 280-25A (Resin)
    ColorBlack
    Viscosity@25℃ Brookfield3,000 cPs
    Specific Gravity2.1 g/cc
    Shelf life @25℃ in sealed container12 months
    TIE™ 280-25B (Hardener)
    ColorBlack
    Viscosity@25℃ Brookfield5,000 cPs
    Shelf life @25℃ in sealed container12 months n

    Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100
    Viscosity @25℃4,000 cPs
    Working pot life (250 g @25℃)45 min
    Specific Gravity2.1g/ccn
    Cure Schedule
    Cure 12 hours at 25℃
    Cure 30 minutes at 70℃

    Cured Properties
    Hardness @25℃85 Shore D
    Service temperature-40℃ to +130℃
    Glass transition temperature Tg92℃
    Elongation0.10%
    Coefficient of thermal expansion, / ℃3.0 X 10-5
    Fire resistance ULMeet 94 V-0
    Moisture absorption % wt gain 24 hours water immersion @25℃0.1

    Thermal
    Thermal Conductivity2.5 W/m-K
    Thermal Impedance @10psi0.31 ℃-in²/W
    ELECTRICAL AS CURED
    Dielectric Strength300 volts / mil
    Dielectric Constant4.2 MHz
    Dissipation factor0.029 MHz
    Volume resistivity, ohm-cm @ 25℃3.0 X 1012

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